公开(公告)号：US20230360931A1

公开(公告)日：2023-11-09

申请号：US18059594

申请日：2022-11-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： JUNGHYUN SONG ,  ANSOOK SUL ,  JEONGHUN KANG ,  DONOK CHOI ,  SUNG YONG PARK

IPC: H01L21/67 ,  C23C16/455 ,  C23C16/44

CPC classification number: H01L21/67057 ,  C23C16/45563 ,  C23C16/4412

Abstract: A substrate processing apparatus includes an outer bath, an inner bath in the outer bath, a chemical solution supply pipe in fluid communication with a portion of the outer bath, and an outer gas supply pipe in fluid communication with another portion of the outer bath. The outer bath includes an outer body providing an outer receiving space, and an outer door coupled to the outer body and configured to close the outer receiving space. An end of the outer gas supply pipe is located in the outer receiving space between the outer body and the inner bath, and a portion of the chemical solution supply pipe is located in the inner bath.