公开(公告)号：US20240087940A1

公开(公告)日：2024-03-14

申请号：US18243725

申请日：2023-09-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Cheonil PARK ,  Myoungchul EUM

IPC: H01L21/683 ,  C09J7/29 ,  C09J7/38

CPC classification number: H01L21/6836 ,  C09J7/29 ,  C09J7/385 ,  C09J2203/326 ,  C09J2301/416 ,  C09J2433/00 ,  H01L2221/68327 ,  H01L2221/68386

Abstract: A wafer temporary adhesive tape includes a device adhesive layer configured to be attached to a device wafer, a base layer on the device adhesive layer, and a carrier adhesive layer on the base layer and configured to be attached to a carrier wafer, wherein the base layer includes a laser decomposable material layer that can be chemically decomposed by absorbing a laser beam.

公开(公告)号：US20230087718A1

公开(公告)日：2023-03-23

申请号：US17861490

申请日：2022-07-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Cheonil PARK ,  MYOUNGCHUL EUM ,  HWAIL JIN

IPC: B32B37/12 ,  H01L21/768 ,  H01L21/304 ,  H01L21/683 ,  B32B7/12 ,  B32B38/10 ,  B32B37/18 ,  B32B3/30

Abstract: A method of manufacturing a semiconductor device may include bonding a carrier substrate onto a device wafer using an adhesive member, wherein the adhesive member includes a base film, a device adhesive film disposed on a lower surface of the base film and contacting the device wafer, and a carrier adhesive film disposed on an upper surface of the base film and contacting the carrier substrate. The device adhesive film includes a gas blowing agent, and the carrier adhesive film may not include a gas blowing agent.

公开(公告)号：US20230040281A1

公开(公告)日：2023-02-09

申请号：US17590717

申请日：2022-02-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Cheonil PARK ,  WONKEUN KIM ,  MYOUNGCHUL EUM

IPC: H01L21/306 ,  B32B43/00 ,  B32B38/16 ,  B32B7/12 ,  H01L21/683 ,  C09J7/40

Abstract: Disclosed are methods of fabricating semiconductor devices and methods of separating substrates. The semiconductor device fabricating method comprises providing a release layer between a carrier substrate and a first surface of a device substrate to attach the device substrate to the carrier substrate, irradiating the carrier substrate with an ultraviolet ray to separate the carrier substrate from the release layer and to expose one surface of the release layer, and performing a cleaning process on the one surface of the release layer to expose the first surface of the device substrate. The release layer includes an aromatic polymerization unit and a siloxane polymerization unit.