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公开(公告)号：US20250062152A1
公开(公告)日：2025-02-20
申请号：US18804824
申请日：2024-08-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyungjun Kim , Cheol-Hee Ahn , Yooseon Hong
IPC: H01L21/683 , C09J4/00 , C09J7/38 , H01L23/00
Abstract: In a dicing film, an adhesive strength of an adhesive layer constituting the dicing film may sufficiently decrease after heat treatment, and a semiconductor die may be easily separated from the dicing film. Accordingly, the effect of improving pickup performance of the semiconductor die may be obtained.
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