公开(公告)号：US20170131358A1

公开(公告)日：2017-05-11

申请号：US15286765

申请日：2016-10-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kudo RYOTARO ,  Dong Jin KEUM ,  Byung Chul JEON ,  Jin Sub CHOI

IPC: G01R31/36 ,  G01R1/20

CPC classification number: G01R31/3606 ,  G01R1/203 ,  G01R15/08

Abstract: A fuel gauge system for measuring the amount of current in a battery is provided. The fuel gauge system includes a first resistive element connected in series to the battery, a second resistive element connected in series to the first resistive element, a first switch connected in parallel to the second resistive element to control a current flowing in the second resistive element, a second switch connected in series to the second resistive element to control the current flowing in the second resistive element, a controller configured to output a first switching signal to the first switch and output a second switching signal to the second switch, and a fuel gauge circuit configured to measure a battery current flowing in the first resistive element and the second resistive element.

公开(公告)号：US20250062238A1

公开(公告)日：2025-02-20

申请号：US18587264

申请日：2024-02-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bong Wee YU ,  Chang Soo KIM ,  Byung Chul JEON ,  Jun Ho HUH

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10 ,  H01L25/16 ,  H10B80/00

Abstract: A semiconductor package is provided. The semiconductor package comprises a package substrate, a first semiconductor chip on the package substrate, a second semiconductor chip spaced apart from the first semiconductor chip on the package substrate, and a bridge die placed below the first semiconductor chip and the second semiconductor chip on the package substrate, wherein the bridge die includes a first face that faces the first semiconductor chip and the second semiconductor chip, a second face that faces the package substrate, a connection wiring structure which is placed on the first face, and connects the first semiconductor chip and the second semiconductor chip, and a power wiring structure which is placed on the second face, and provides power to the first semiconductor chip and the second semiconductor chip.