公开(公告)号：US10826159B2

公开(公告)日：2020-11-03

申请号：US15977551

申请日：2018-05-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gyu Sub Kim ,  Jin Woo Jung ,  Byoung Ryoul Song ,  Sin Hyung Jeon ,  So Young Lee ,  Jae Bong Chun

IPC: H01Q1/24 ,  H01Q21/28 ,  H01Q9/42 ,  B29C45/14 ,  H01Q1/38 ,  H01Q9/04

Abstract: An electronic device is provided. The electronic device includes a front glass plate, a back glass plate, and a side member including a conductive portion, at least one conductive pattern formed on an edge portion of the front glass plate, a wireless communication circuit positioned inside a housing and electrically connected to the conductive portion and the at least one conductive pattern. In addition, various embodiments understood through the disclosure may be provided.