SEMICONDUCTOR DEVICES
    1.
    发明申请

    公开(公告)号:US20200227519A1

    公开(公告)日:2020-07-16

    申请号:US16545906

    申请日:2019-08-20

    Abstract: A semiconductor device includes a channel layer located on a substrate, the channel layer including a conductive oxide, a gate structure located on the channel layer, the gate structure including a gate electrode and gate spacers located on both sidewalls of the gate electrode, and source and drain regions located on both sides of the gate structure in recess regions having a first height from a top surface of the channel layer. The source and drain regions are configured to apply tensile stress to a portion of the channel layer located under the gate structure.

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