公开(公告)号：US20240120287A1

公开(公告)日：2024-04-11

申请号：US18480148

申请日：2023-10-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Won PARK ,  A Yeong CHA ,  Byeong-Hwan SON ,  Hye Jin LEE ,  Jung Hyun CHOI ,  Jong Hee HAN

IPC: H01L23/544 ,  G03F7/00

CPC classification number: H01L23/544 ,  G03F7/70633 ,  H01L2223/54426

Abstract: Provided is an overlay mark. The overlay mark comprises a substrate, a lower overlay in the substrate, a pattern layer on the substrate, and an upper overlay defining an opening on the pattern layer. The lower overlay does not overlap the upper overlay in a thickness direction of the substrate.