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公开(公告)号：US20220189697A1
公开(公告)日：2022-06-16
申请号：US17229932
申请日：2021-04-14
发明人： Heung Kil Park , Gu Won Ji , Sang Soo Park
摘要： An electronic component includes: an ESD discharge member including a substrate having first and second surfaces opposing each other, first and second through-holes penetrating through the substrate, and first and second conductors; and a multilayer capacitor disposed on the first surface of the substrate, in which the multilayer capacitor may include: a capacitor body; and first and second external electrodes disposed outside the capacitor body and connected to the first and second conductors, respectively, and the first and second conductors may include first and second via electrodes coated on inner walls of the first and second through-holes, respectively.
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公开(公告)号：US11309133B2
公开(公告)日：2022-04-19
申请号：US16860704
申请日：2020-04-28
发明人： Heung Kil Park , Hun Gyu Park , Se Hun Park , Gu Won Ji
摘要： The multilayer electronic component includes a capacitor body having first to sixth surfaces; first and second external electrodes including first and second connecting portions, and first and second band portions; first and second connection terminals connected to the first band portion; and third and fourth connection terminals connected to the second band portion. The first and second connection terminals include a first connection surface facing the first band portion, a second connection surface opposing the first connection surface, and a first circumferential surface connecting the first and second connection surfaces, a cross section of the first circumferential surface being circular. The third and fourth connection terminals include a third connection surface facing the second band portion, a fourth connection surface opposing the third connection surface, and a second circumferential surface connecting the third and fourth connection surfaces, a cross section of the second circumferential surface being circular.
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公开(公告)号：US11133132B2
公开(公告)日：2021-09-28
申请号：US16854237
申请日：2020-04-21
发明人： Heung Kil Park , Se Hun Park , Hun Gyu Park , Tae Hoon Kim , Gu Won Ji
摘要： A multilayer electronic component includes a capacitor body having first to six surfaces, the capacitor body including a dielectric layer and first and second internal electrodes having one ends exposed through the third and fourth sides, respectively, first and second external electrodes including first and second connection portions disposed on the third and fourth surfaces of the capacitor body, respectively, and first and second band portions spaced apart from each other on the first surface of the capacitor body, respectively, a first connection terminal disposed on the first band portion and having a first cutout disposed in a lower surface thereof, open toward the third surface of the capacitor body, and a second connection terminal disposed on the second band portion and having a second cutout formed in a lower surface thereof, open toward the fourth surface of the capacitor body.
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公开(公告)号：US20210076499A1
公开(公告)日：2021-03-11
申请号：US16846806
申请日：2020-04-13
发明人： Heung Kil Park , Se Hun Park , Hun Gyu Park , Woo Chul Shin , Ji Hong Jo
摘要： A multilayer electronic component includes: a capacitor body having first to sixth surfaces, and including first and second internal; first and second external electrodes including first and second connection portions and first and second band portions; and a connection terminal including first and second land portions disposed on the first and second band portions, respectively, and having first and second cut-out portions, respectively. First and second solder accommodating portions are provided by the first and second cut-out portions in lower portions of the first and second band portions, respectively, and, 0.2≤SA1/BW1≤0.5 and 0.2≤SA2/BW2≤0.5 which in BW1 is an area of the first band portion, SA1 is an area of the first solder accommodating portion, BW2 is an area of the second band portion, and SA2 is an area of the second solder accommodating portion.
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公开(公告)号：US10453616B2
公开(公告)日：2019-10-22
申请号：US16049174
申请日：2018-07-30
发明人： Se Hun Park , Gu Won Ji , Heung Kil Park
IPC分类号： H05K1/02 , H05K1/11 , H05K1/14 , H05K1/18 , H05K3/30 , H01G4/01 , H01G4/06 , H01G4/12 , H01G4/30 , H01G4/40 , H01G4/005 , H01G4/248 , H05K3/34
摘要： A composite electronic component includes: a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other. The multilayer ceramic capacitor includes a first ceramic body, and first and second external electrodes disposed on both end portions of the first ceramic body. The ceramic chip includes a second ceramic body disposed on a lower portion of the multilayer ceramic capacitor, and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes. A width of first regions of the second ceramic body in which the first and second terminal electrodes are disposed is wider than a width of a second region of the second ceramic body between the first regions.
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公开(公告)号：US10285271B2
公开(公告)日：2019-05-07
申请号：US15217388
申请日：2016-07-22
发明人： Heung Kil Park , Jong Hwan Park , Young Ghyu Ahn
摘要： A multilayer ceramic electronic component includes a multilayer ceramic capacitor, first and second metal frames, and an insulating cover. The multilayer ceramic capacitor includes a ceramic body having a plurality of dielectric layers stacked together and first and second internal electrodes alternately disposed between pairs of adjacent dielectric layers, and external electrodes disposed on two end surfaces of the ceramic body opposite each other in a length direction orthogonal to the stacking direction. The first and second metal frames are each disposed along a respective one of two end surfaces of the multilayer ceramic capacitor opposite each other in the length direction, and are each disposed along upper and lower surfaces of the multilayer ceramic capacitor. The insulating cover is disposed to enclose the multilayer ceramic capacitor and upper surfaces of the first and second metal frames. A board can have the multilayer ceramic electronic component mounted thereon.
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公开(公告)号：US10269495B2
公开(公告)日：2019-04-23
申请号：US15404343
申请日：2017-01-12
发明人： Heung Kil Park , Jong Hwan Park
摘要： A capacitor component includes a body including a plurality of dielectric layers having a layered structure and a first internal electrode and a second internal electrode alternately disposed with respective dielectric layers of the plurality of dielectric layers disposed therebetween. A first external electrode is disposed on a first surface and a second surface of the body opposing each other, and is connected to the first internal electrode. A second external electrode is disposed on at least one of a third surface and a fourth surface of the body connecting the first surface to the second surface and opposing each other, and is connected to the second internal electrode. The first internal electrode and the second internal electrode provide a plurality of resonance frequencies. In some examples, each of the first internal electrode and the second internal electrode is divided into a plurality of regions spaced apart from each other.
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公开(公告)号：US09978523B1
公开(公告)日：2018-05-22
申请号：US15651703
申请日：2017-07-17
发明人： Heung Kil Park , Jong Hwan Park , Se Hun Park
CPC分类号： H01G4/30 , H01G4/005 , H01G4/12 , H01G4/248 , H05K1/181 , H05K2201/10015 , H05K2201/10636
摘要： A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of first and second internal electrodes, the capacitor body having a first surface and a second surface opposing each other, the capacitor body having a third surface and a fourth surface connected to the first surface and the second surface and opposing each other, and first and second band portions extended from the first and second connection portions to portions of the first surface and the second surface of the capacitor body and portions of a fifth surface and a sixth surface of the capacitor body, respectively, an insulating layer covering the first and second band portions, and a first terminal electrode and a second terminal electrode covering the first and second external electrodes, and portions of the insulating layer disposed on the first surface of the capacitor body and spaced apart from each other.
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公开(公告)号：US09706641B1
公开(公告)日：2017-07-11
申请号：US15285115
申请日：2016-10-04
发明人： Heung Kil Park , Jong Hwan Park , Young Ghyu Ahn
CPC分类号： H01G4/248 , H01G2/065 , H01G4/0085 , H01G4/1227 , H01G4/232 , H01G4/30 , H05K1/181 , H05K3/3442 , H05K2201/10015
摘要： A multilayer capacitor includes internal electrodes having a plurality of lead portions exposed in a width direction of a body, and external electrodes connected to the lead portions, the external electrodes including a conducting layer, conductive resin layers, and a plating layer, respectively, and a board having the same.
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公开(公告)号：US09648746B2
公开(公告)日：2017-05-09
申请号：US14663445
申请日：2015-03-19
发明人： Heung Kil Park , Sang Soo Park
CPC分类号： H05K1/181 , H05K1/0233 , H05K3/3442 , H05K2201/10015 , H05K2201/1003 , H05K2201/10515 , H05K2201/1053 , Y02P70/611 , Y02P70/613
摘要： There is provided a composite electronic component and a board having the same, and the composite electronic component may include: an interposer board, and first and second electronic components mounted on upper and lower surfaces of the interposer board, respectively, and first and second electronic components are electrically connected to each other by an electrical connection part provided on the interposer board.
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