公开(公告)号：US09868634B2

公开(公告)日：2018-01-16

申请号：US14682501

申请日：2015-04-09

Applicant: Samsung Display Co. Ltd.

Inventor： Dae Young Lee ,  Hyun Bin Cho ,  Eun Jung Kim ,  Gug Rae Jo

IPC: B81C99/00 ,  B29C59/00 ,  G03F7/00 ,  G02B5/30 ,  G02B27/28 ,  B29L11/00 ,  B29C33/42

CPC classification number: B81C99/009 ,  B29C33/42 ,  B29C59/002 ,  B29L2011/0066 ,  G02B5/3058 ,  G02B27/286 ,  G03F7/0002 ,  G03F7/0007

Abstract: A method for manufacturing at least one stamp may include preparing a mold that includes mold protrusions, wherein the mold protrusions extend parallel to each other in a plan view of the mold and include a first mold protrusion. The method may further include providing resin on the mold, wherein the resin partially covers the mold protrusions without completely covering the mold protrusions, and wherein a side of the resin is at an angle with respect to the first mold protrusion in a plan view of a structure that includes the mold and the resin. The method may further include curing the resin to form cured resin. The method may further include forming a stamp that includes the cured resin.