公开(公告)号：US11195742B2

公开(公告)日：2021-12-07

申请号：US16909956

申请日：2020-06-23

Applicant: Samsung Display Co., Ltd.

Inventor： Heung Yeol Na ,  Kang Won Lee ,  Yoon Jae Lee

IPC: H01L21/683 ,  H01L21/67 ,  H01L25/075 ,  H01L33/62 ,  B25J15/00 ,  B25J9/00 ,  B25J9/02

Abstract: A micro device transfer apparatus and a micro device transfer method are provided. The micro device transfer apparatus comprises a stage unit including a stage where a target substrate is to be disposed, a plurality of transfer head units disposed above the stage, and a transfer head unit moving part configured to move the plurality of transfer head units, wherein, the transfer head unit comprises a carrier substrate fastening part configured to fasten a carrier substrate where a plurality of micro devices are disposed, a mask unit disposed above the carrier substrate fastening part, the mask unit comprising a mask including an opening part and a shielding part, a light emitting part disposed on the mask unit, and a housing formed around the carrier substrate fastening part, the mask unit, and the light emitting part.

公开(公告)号：US11862500B2

公开(公告)日：2024-01-02

申请号：US17154861

申请日：2021-01-21

Applicant: Samsung Display Co., Ltd.

Inventor： Jae Won Shim ,  Yoon Jae Lee ,  Sung Lae Kim ,  Kang Won Lee ,  Kyung Hoon Chung

IPC: H01L21/683 ,  H01L21/687 ,  C23C14/24 ,  C23C14/50 ,  H10K71/16

CPC classification number: H01L21/6833 ,  C23C14/24 ,  C23C14/50 ,  H01L21/6875 ,  H01L21/68771 ,  H10K71/16

Abstract: An apparatus for manufacturing a display device includes: a first housing having a first chamber; a support member disposed in the first chamber and including a frame having a plurality of openings; a plurality of adhesive patterns disposed on the frame; and a plurality of electrostatic supports overlapping the plurality of openings and supported for reciprocal movement in respective ones of the openings.

公开(公告)号：US11784081B2

公开(公告)日：2023-10-10

申请号：US17515159

申请日：2021-10-29

Applicant: Samsung Display Co., Ltd.

Inventor： Heung Yeol Na ,  Kang Won Lee ,  Yoon Jae Lee

IPC: H01L21/683 ,  H01L21/67 ,  H01L25/075 ,  H01L33/62 ,  B25J15/00 ,  B25J9/00 ,  B25J9/02

CPC classification number: H01L21/6835 ,  B25J9/0087 ,  B25J9/026 ,  B25J15/0052 ,  H01L21/67144 ,  H01L25/0753 ,  H01L33/62 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2933/0066

Abstract: A micro device transfer apparatus and a micro device transfer method are provided. The micro device transfer apparatus comprises a stage unit including a stage where a target substrate is to be disposed, a plurality of transfer head units disposed above the stage, and a transfer head unit moving part configured to move the plurality of transfer head units, wherein, the transfer head unit comprises a carrier substrate fastening part configured to fasten a carrier substrate where a plurality of micro devices are disposed, a mask unit disposed above the carrier substrate fastening part, the mask unit comprising a mask including an opening part and a shielding part, a light emitting part disposed on the mask unit, and a housing formed around the carrier substrate fastening part, the mask unit, and the light emitting part.