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公开(公告)号：US11195742B2
公开(公告)日：2021-12-07
申请号：US16909956
申请日：2020-06-23
Applicant: Samsung Display Co., Ltd.
Inventor： Heung Yeol Na , Kang Won Lee , Yoon Jae Lee
IPC: H01L21/683 , H01L21/67 , H01L25/075 , H01L33/62 , B25J15/00 , B25J9/00 , B25J9/02
Abstract: A micro device transfer apparatus and a micro device transfer method are provided. The micro device transfer apparatus comprises a stage unit including a stage where a target substrate is to be disposed, a plurality of transfer head units disposed above the stage, and a transfer head unit moving part configured to move the plurality of transfer head units, wherein, the transfer head unit comprises a carrier substrate fastening part configured to fasten a carrier substrate where a plurality of micro devices are disposed, a mask unit disposed above the carrier substrate fastening part, the mask unit comprising a mask including an opening part and a shielding part, a light emitting part disposed on the mask unit, and a housing formed around the carrier substrate fastening part, the mask unit, and the light emitting part.
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公开(公告)号：US10676811B2
公开(公告)日：2020-06-09
申请号：US15265868
申请日：2016-09-15
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor： Heung Yeol Na , Dong Wook Kim , Jae Wan Seol , Seong Ho Jeong
Abstract: A method of manufacturing a display device is provided. A method of manufacturing a display device comprises preparing a thin film forming apparatus including a crucible, which stores a source material for forming a thin film, and a front heatsink, which is disposed on the crucible and includes a reflective plate, wherein the reflective plate has a first surface with a first reflectivity and a second surface with a second reflectivity, which is different from the first reflectivity; and forming a thin film on a substrate by evaporating the source material of the thin film forming apparatus.
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公开(公告)号：US12237185B2
公开(公告)日：2025-02-25
申请号：US17588535
申请日：2022-01-31
Applicant: Samsung Display Co., LTD.
Inventor： Heung Yeol Na , Tae Hun Kim , Jung Woo Choi
Abstract: A laser machining apparatus includes, a processing chamber, a window disposed in a surface of the processing chamber, a substrate carrier disposed inside the processing chamber and facing the window, a laser irradiator which irradiates a laser onto the substrate carrier through the window, a protector supplier disposed on a side of the processing chamber, a protector retriever disposed on an opposite side of the processing chamber opposite to the side of the processing chamber, and a protector which connects the protector supplier with the protector retriever, where at least a portion of the protector is disposed between the substrate carrier and the window in the processing chamber.
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公开(公告)号：US11784081B2
公开(公告)日：2023-10-10
申请号：US17515159
申请日：2021-10-29
Applicant: Samsung Display Co., Ltd.
Inventor： Heung Yeol Na , Kang Won Lee , Yoon Jae Lee
IPC: H01L21/683 , H01L21/67 , H01L25/075 , H01L33/62 , B25J15/00 , B25J9/00 , B25J9/02
CPC classification number: H01L21/6835 , B25J9/0087 , B25J9/026 , B25J15/0052 , H01L21/67144 , H01L25/0753 , H01L33/62 , H01L2221/68354 , H01L2221/68363 , H01L2933/0066
Abstract: A micro device transfer apparatus and a micro device transfer method are provided. The micro device transfer apparatus comprises a stage unit including a stage where a target substrate is to be disposed, a plurality of transfer head units disposed above the stage, and a transfer head unit moving part configured to move the plurality of transfer head units, wherein, the transfer head unit comprises a carrier substrate fastening part configured to fasten a carrier substrate where a plurality of micro devices are disposed, a mask unit disposed above the carrier substrate fastening part, the mask unit comprising a mask including an opening part and a shielding part, a light emitting part disposed on the mask unit, and a housing formed around the carrier substrate fastening part, the mask unit, and the light emitting part.
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