公开(公告)号：US08842249B2

公开(公告)日：2014-09-23

申请号：US14011923

申请日：2013-08-28

Applicant: Samsung Display Co., Ltd.

Inventor： Sung-Hoon Kim ,  Il-Yong Yoon ,  Yong-Woo Lee

IPC: G02F1/1343 ,  G02F1/1362

CPC classification number: G02F1/134336 ,  G02F1/13624 ,  G02F2001/134345

Abstract: A display substrate includes a transparent substrate, a gate line formed on the transparent substrate, a data line crossing the gate line, a thin film transistor electrically connected to the gate line and the data line, and a pixel electrode. The pixel electrode includes a body electrode section electrically connected to the thin film transistor and a plurality of protruding electrodes protruding from the body electrode section. Each of the protruding electrodes includes a trapezoidal electrode having two sides that are inclined with respect to a protrusion direction that is a lengthwise direction of the body electrode section.

Abstract translation: 显示基板包括透明基板，形成在透明基板上的栅极线，与栅极线交叉的数据线，与栅极线和数据线电连接的薄膜晶体管和像素电极。 像素电极包括电连接到薄膜晶体管的主体电极部分和从主体电极部突出的多个突出电极。 每个突出电极包括梯形电极，该梯形电极具有相对于作为主体电极部分的长度方向的突出方向倾斜的两个侧面。

公开(公告)号：US08860905B2

公开(公告)日：2014-10-14

申请号：US14037733

申请日：2013-09-26

Applicant: Samsung Display Co., Ltd.

Inventor： Jin-Hee Park ,  Yong-Woo Lee ,  Won-Ju Kim ,  Yong-Il Kim

IPC: G02F1/1333 ,  G09F13/04 ,  F21V7/00 ,  F21V21/00 ,  G02F1/1335 ,  H05K1/14

Abstract: A light emitting diode (“LED”) backlight assembly. The LED backlight assembly has a bottom container which has a bottom plate and a side edge surrounding the bottom plate, a plurality of light emitting diode printed circuit boards (“LED-PCBs”) on the bottom plate, and a connector which is closely located to edge located LEDs. The connector of the LED-PCB is closely located to an LED driving board, which is disposed at a lateral space of a lateral part of the bottom container to limit a vertical thickness of the backlight light assembly.

公开(公告)号：US09753314B2

公开(公告)日：2017-09-05

申请号：US14459177

申请日：2014-08-13

Applicant: Samsung Display Co., LTD.

Inventor： Won-Seok Kim ,  Toru Tsunekawa ,  Yong-Woo Lee

IPC: G02F1/1333 ,  G02F1/1343 ,  F21V8/00 ,  H05K1/02

CPC classification number: G02F1/133308 ,  G02B6/0066 ,  G02B6/0088 ,  G02F1/13439 ,  G02F2001/133317 ,  H05K1/028 ,  H05K2201/10136

Abstract: A display apparatus includes a display panel configured to display an image, a lower receiving container comprising a bottom portion and a side wall and accommodating the display panel and a mold frame integrally formed with the lower receiving container, extending along the side wall of the lower receiving container, and comprising a plurality of groove portions extending from an inner surface of the mold frame toward an outer surface of the mold frame.

公开(公告)号：US08922732B2

公开(公告)日：2014-12-30

申请号：US14037733

申请日：2013-09-26

Applicant: Samsung Display Co., Ltd.

Inventor： Jin-Hee Park ,  Yong-Woo Lee ,  Won-Ju Kim ,  Yong-Il Kim

IPC: G02F1/1333 ,  G09F13/04 ,  F21V7/00 ,  F21V21/00 ,  G02F1/1335 ,  H05K1/14

CPC classification number: G02F1/133603 ,  G02F1/133608 ,  G02F2001/133612 ,  H05K1/148

Abstract: A light emitting diode (“LED”) backlight assembly. The LED backlight assembly has a bottom container which has a bottom plate and a side edge surrounding the bottom plate, a plurality of light emitting diode printed circuit boards (“LED-PCBs”) on the bottom plate, and a connector which is closely located to edge located LEDs. The connector of the LED-PCB is closely located to an LED driving board, which is disposed at a lateral space of a lateral part of the bottom container to limit a vertical thickness of the backlight light assembly.

Abstract translation: 发光二极管（“LED”）背光组件。 LED背光组件具有底部容器，底部容纳有围绕底板的侧边缘，底板上的多个发光二极管印刷电路板（“LED-PCB”）以及紧邻的连接器 到边缘定位的LED。 LED-PCB的连接器位于LED驱动板上，LED驱动板设置在底部容器的侧部的侧向空间中，以限制背光灯组件的垂直厚度。

公开(公告)号：US08810748B2

公开(公告)日：2014-08-19

申请号：US14037733

申请日：2013-09-26

Applicant: Samsung Display Co., Ltd.

Inventor： Jin-Hee Park ,  Yong-Woo Lee ,  Won-Ju Kim ,  Yong-Il Kim

IPC: G02F1/1333 ,  G09F13/04 ,  F21V7/00 ,  F21V21/00

Abstract: A light emitting diode (“LED”) backlight assembly. The LED backlight assembly has a bottom container which has a bottom plate and a side edge surrounding the bottom plate, a plurality of light emitting diode printed circuit boards (“LED-PCBs”) on the bottom plate, and a connector which is closely located to edge located LEDs. The connector of the LED-PCB is closely located to an LED driving board, which is disposed at a lateral space of a lateral part of the bottom container to limit a vertical thickness of the backlight light assembly.

公开(公告)号：US20130342780A1

公开(公告)日：2013-12-26

申请号：US14011923

申请日：2013-08-28

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Sung-Hoon Kim ,  Il-Yong Yoon ,  Yong-Woo Lee

IPC: G02F1/1343

CPC classification number: G02F1/134336 ,  G02F1/13624 ,  G02F2001/134345

Abstract: A display substrate includes a transparent substrate, a gate line formed on the transparent substrate, a data line crossing the gate line, a thin film transistor electrically connected to the gate line and the data line, and a pixel electrode. The pixel electrode includes a body electrode section electrically connected to the thin film transistor and a plurality of protruding electrodes protruding from the body electrode section. Each of the protruding electrodes includes a trapezoidal electrode having two sides that are inclined with respect to a protrusion direction that is a lengthwise direction of the body electrode section.