公开(公告)号：US20210005676A1

公开(公告)日：2021-01-07

申请号：US16888226

申请日：2020-05-29

Applicant: Samsung Display Co., Ltd.

Inventor： Sungkyun PARK ,  Yejoo JUN ,  Jungmoo HONG

IPC: H01L27/32 ,  H01L51/56 ,  H01L51/52

Abstract: A display device includes: a substrate including a display area and a non-display area; and a touch unit on the substrate, wherein the touch unit includes: a first inorganic insulating layer in the display area; a first conductive layer on the first inorganic insulating layer; a first organic layer on the first conductive layer; a second conductive layer on the first organic layer and electrically connected to the first conductive layer through a first contact hole in the first organic layer; and a second organic layer on the second conductive layer so as to cover a lateral surface and a top surface of the second conductive layer and including a photosensitive material.

公开(公告)号：US20210320284A1

公开(公告)日：2021-10-14

申请号：US17177316

申请日：2021-02-17

Applicant: Samsung Display Co., Ltd.

Inventor： Sungkyun PARK ,  Jung-Moo HONG ,  Doyeon KIM ,  Sanghyun JUN ,  Yejoo JUN

IPC: H01L51/56 ,  H01L51/52

Abstract: Disclosed is a method of fabricating a display device. The method comprises forming a dielectric layer on an encapsulation layer including a first encapsulation region and a second encapsulation region adjacent to the first encapsulation region, forming a conductive layer on the dielectric layer, forming a first photoresist layer on the conductive layer that overlaps each of the first and second encapsulation regions, forming a second photoresist layer on the first photoresist layer that overlaps the second encapsulation region, and etching the conductive layer based on the first and second photoresist layers. When viewed in a thickness direction of a display panel including the encapsulation layer, at least a portion of the encapsulation layer overlapping the second encapsulation region has a thickness greater than that of the encapsulation layer overlapping the first encapsulation region.