公开(公告)号：US20240015897A1

公开(公告)日：2024-01-11

申请号：US18126605

申请日：2023-03-27

Applicant: Samsung Display Co., Ltd.

Inventor： HYO-CHUL LEE ,  YOUNYEE KANG ,  JI-WON KIM ,  SEUNGIN BAEK ,  IN SOO WANG

IPC: H05K5/00 ,  H05K1/18

CPC classification number: H05K5/0018 ,  H05K1/189 ,  H05K5/0086 ,  H05K2201/10128 ,  H05K2201/09327

Abstract: A circuit board includes a first body part, a second body part and a connection part. The first body part includes a first contact surface and has a multi-layered structure. The second body part includes a second contact surface, has a multi-layered structure, and includes a first signal line spaced apart from the second contact surface. The connection part includes a third contact surface between the first contact surface and the second contact surface, and connects the first body part and the second body part to each other.