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公开(公告)号:US20220028952A1
公开(公告)日:2022-01-27
申请号:US17172691
申请日:2021-02-10
Applicant: Samsung Display Co., Ltd.
Inventor: Euijeong KANG , Seungsoo RYU , Sijoon SONG
IPC: H01L27/32
Abstract: A display apparatus includes: a display panel comprising a display area and a pad area; a pad portion in the pad area and comprising a plurality of pad terminals; a driving circuit portion in which a plurality of driving terminals are respectively electrically connected to the plurality of pad terminals; and a displacement preventing portion comprising a first displacement preventing portion between the plurality of pad terminals and a second displacement preventing portion between the plurality of driving terminals and coupled to the first displacement preventing portion.
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公开(公告)号:US20210028271A1
公开(公告)日:2021-01-28
申请号:US16791633
申请日:2020-02-14
Applicant: Samsung Display Co., Ltd.
Inventor: Jeongjin PARK , Seungsoo RYU , Euijeong KANG , Sanghyuck YOON , Taeho LEE
Abstract: A display apparatus includes a lower substrate including a display area including a display element and a non-display area around the display area; a sealing member disposed on the non-display area and around the display area; a terminal portion disposed on the non-display area and including at least one internal terminal extending toward an edge of the lower substrate; a fanout line portion connected to the at least one internal terminal and including a line extending to the display area; an upper substrate disposed to face the lower substrate and bonded to the lower substrate by the sealing member; and an upper groove portion on a side surface of the upper substrate to correspond to the at least one internal terminal.
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公开(公告)号:US20230403895A1
公开(公告)日:2023-12-14
申请号:US18202187
申请日:2023-05-25
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor: Youngok PARK , Seungsoo RYU , Heeju WOO
IPC: H10K59/131 , G09G3/3233 , H10K59/12
CPC classification number: H10K59/131 , G09G3/3233 , H10K59/1201 , G09G2300/0842
Abstract: A method of manufacturing a display apparatus in which the occurrence of a short circuit may be reduced includes forming a pad in a peripheral area of a substrate having a display area and the peripheral area outside the display area, disposing a first conductive particle on a surface of the pad, disposing a second conductive particle on a surface of a bump included in an electronic chip package, the surface of the bump facing the surface of the pad, and electrically connecting the pad to the bump by bringing the first conductive particle into contact with the second conductive particle.
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