DISPLAY DEVICE
    1.
    发明申请

    公开(公告)号:US20210193789A1

    公开(公告)日:2021-06-24

    申请号:US17108354

    申请日:2020-12-01

    Abstract: A display device includes a pixel array disposed on a base substrate, a side terminal electrically connected to the pixel array, a connection pad including a first side surface contacting a side surface of the side terminal, and a driving device bonding to a second side surface of the connection pad, where the second side surface is opposite to the first side surface. The side terminal includes a resistance-reducing layer and an upper conductive layer, the resistance-reducing layer includes a first conductive material, the upper conductive layer is disposed on the resistance-reducing layer and includes a second conductive material having an oxidation resistance greater than the first conductive material. A portion of the upper conductive layer is disposed between the connection pad and the resistance-reducing layer such that the resistance-reducing layer is spaced apart from the connection pad.

    DISPLAY DEVICE, APPARATUS FOR MANUFACTURING DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

    公开(公告)号:US20220350436A1

    公开(公告)日:2022-11-03

    申请号:US17865047

    申请日:2022-07-14

    Abstract: A display device includes a display panel including display pads, display connection pads disposed on a side surface of the display panel and connected to the display pads, a touch member including touch pads disposed on a display surface perpendicular to the side surface of the display panel, and touch connection pads overlapping a top surface of the touch member and the side surface of the display panel and connected to the touch pads. The side surface of the display panel includes a first area overlapping the display connection pads, a second area overlapping the touch connection pads, and a third area which does not overlap the display connection pads and does not overlap the touch connection pads. The first area, the second area, and the third area are located on a same plane.

    BACKLIGHT ASSEMBLY AND DISPLAY INCLUDING THE SAME
    3.
    发明申请
    BACKLIGHT ASSEMBLY AND DISPLAY INCLUDING THE SAME 审中-公开
    背光组件和显示器包括它们

    公开(公告)号:US20150185410A1

    公开(公告)日:2015-07-02

    申请号:US14263190

    申请日:2014-04-28

    Abstract: A backlight assembly includes a light source portion configured to emit light and a wavelength conversion member disposed on an upper portion of the light source portion. The wavelength conversion member is configured to convert a wavelength of the light emitted from the light source portion. A light guide plate is disposed on a side portion of the wavelength conversion member. The light guide plate is configured to receive wavelength-converted light from the wavelength conversion member.

    Abstract translation: 背光组件包括被配置为发光的光源部分和设置在光源部分的上部的波长转换部件。 波长转换构件被配置为转换从光源部发射的光的波长。 导光板设置在波长转换部件的侧部。 导光板被配置为接收来自波长转换构件的波长转换的光。

    BACKLIGHT UNIT AND DISPLAY DEVICE INCLUDING THE SAME
    4.
    发明申请
    BACKLIGHT UNIT AND DISPLAY DEVICE INCLUDING THE SAME 审中-公开
    背光单元和包括其的显示装置

    公开(公告)号:US20160266299A1

    公开(公告)日:2016-09-15

    申请号:US15064166

    申请日:2016-03-08

    Abstract: A backlight unit that may be used with a liquid crystal display is presented. The backlight unit includes: a bottom chassis; a light source disposed at an edge of the bottom chassis; a light-converting member disposed on the light source and including quantum dots for changing a wavelength of light emitted from the light source; and a light guide disposed on the bottom chassis adjacent to the light-converting member and positioned to receive light emitted from the light-converting member.

    Abstract translation: 提出了可以与液晶显示器一起使用的背光单元。 背光单元包括:底部底盘; 设置在所述底部底盘的边缘处的光源; 光转换部件,其设置在所述光源上并且包括用于改变从所述光源发射的光的波长的量子点; 以及光导,其设置在所述底架上,与所述光转换构件相邻并且被定位成接收从所述光转换构件发射的光。

    DISPLAY DEVICE
    5.
    发明申请

    公开(公告)号:US20250056983A1

    公开(公告)日:2025-02-13

    申请号:US18601888

    申请日:2024-03-11

    Abstract: A display device includes: a first substrate, a barrier film, and a second substrate; a thin-film transistor layer, an emission material layer, an encapsulation layer and a touch detecting unit stacked on the second substrate; and a pad area in a non-display area and comprising pads connected to a driving substrate and facing the first substrate, the pads comprising: a pad contact hole formed by etching the second substrate and the barrier film; a first inorganic film and a pad electrode stacked on an inner circumferential surface of the pad contact hole; and a rear contact hole etched through a portion of the first substrate, and a pad bonded to the rear contact hole, with a middle hole connecting the pad contact hole with the rear contact hole, and the pad of the driving substrate is electrically connected to the pad electrode through a lower conductive ink.

    DISPLAY DEVICE, APPARATUS FOR MANUFACTURING DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

    公开(公告)号:US20220107697A1

    公开(公告)日:2022-04-07

    申请号:US17403208

    申请日:2021-08-16

    Abstract: A display device includes a display panel including display pads, display connection pads disposed on a side surface of the display panel and connected to the display pads, a touch member including touch pads disposed on a display surface perpendicular to the side surface of the display panel, and touch connection pads overlapping a top surface of the touch member and the side surface of the display panel and connected to the touch pads. The side surface of the display panel includes a first area overlapping the display connection pads, a second area overlapping the touch connection pads, and a third area which does not overlap the display connection pads and does not overlap the touch connection pads. The first area, the second area, and the third area are located on a same plane.

    PRINTED CIRCUIT FILM, DISPLAY DEVICE, AND METHOD OF FABRICATING PRINTED CIRCUIT FILM

    公开(公告)号:US20210385950A1

    公开(公告)日:2021-12-09

    申请号:US17198197

    申请日:2021-03-10

    Abstract: A printed circuit film includes: a base film including a first film portion extending in a first direction, a second film portion extending in the first direction, and a third film portion extending in the first direction; a plurality of lead wires extending in the second direction and disposed on the first, second, and third film portions, the plurality of lead wires being spaced apart from each other in the first direction; and a bonding member including: a conductive member disposed to overlap the plurality of lead wires on the first film portion; a first non-conductive member disposed to overlap the plurality of lead wires and the second film portion; and a second non-conductive member disposed to overlap the plurality of lead wires and the third film portion, wherein the conductive member is disposed between the first non-conductive member and the second non-conductive member in the second direction.

    LIGHT-EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    9.
    发明申请
    LIGHT-EMITTING DIODE PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
    发光二极管封装及其制造方法

    公开(公告)号:US20150219288A1

    公开(公告)日:2015-08-06

    申请号:US14306127

    申请日:2014-06-16

    CPC classification number: F21K9/90 H01L33/44 H01L33/502 H01L33/507 H01L33/644

    Abstract: A light-emitting diode (LED) package and a method of manufacturing the same are provided. The LED package includes a package mold, an LED chip located on a surface of the package mold, and a wavelength converter located on the surface of the package mold and separated from the LED chip. The wavelength converter includes a first barrier layer located on the surface of the package mold, a wavelength conversion layer located on the first barrier layer, and a second barrier layer located on the wavelength conversion layer.

    Abstract translation: 提供一种发光二极管(LED)封装及其制造方法。 LED封装包括封装模具,位于封装模具表面上的LED芯片和位于封装模具表面上并与LED芯片分离的波长转换器。 波长转换器包括位于封装模具表面上的第一阻挡层,位于第一阻挡层上的波长转换层和位于波长转换层上的第二阻挡层。

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