DISPLAY DEVICE
    1.
    发明公开
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20230383152A1

    公开(公告)日:2023-11-30

    申请号:US18144080

    申请日:2023-05-05

    CPC classification number: C09J151/003 H05K5/03

    Abstract: A display device of an embodiment includes a display module, a window disposed on the upper side of the display module, a protective layer disposed on the upper side of the window, a housing disposed on the lower side of the display module, and a protective layer adhesive layer disposed between the window and the protective layer, wherein the protective layer adhesive layer includes a polymer compound including multiple polymer main chains and multiple crosslinking parts, the crosslinking parts form multiple crosslinking bonds between the polymer main chains through Diels-Alder reaction, and the crosslinking bonds are separated through Retro-Diels-Alder reaction, thereby showing easy reworkability and excellent or suitable mechanical properties.

    DISPLAY DEVICE
    3.
    发明公开
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20230345804A1

    公开(公告)日:2023-10-26

    申请号:US18113277

    申请日:2023-02-23

    Abstract: A display device includes a display panel including light emitting regions, in which light emitting elements are respectively disposed, and a non-light emitting region adjacent to the light emitting regions and a light control layer including an organic pattern in which pattern openings, which overlap the non-light emitting region and respectively correspond to the light emitting regions, are defined, a first adhesive layer which covers the organic pattern and has a lower refractive index than the organic pattern, a second adhesive layer which is disposed on the first adhesive layer and has a higher refractive index than the first adhesive layer, and a third adhesive layer which is disposed on the second adhesive layer and has a lower refractive index than the second adhesive layer.

    SUBSTRATE-STACKING STRUCTURE AND SUBSTRATE-CUTTING METHOD

    公开(公告)号:US20220143755A1

    公开(公告)日:2022-05-12

    申请号:US17401135

    申请日:2021-08-12

    Abstract: A substrate-cutting method includes preparing a first substrate in which a plurality of first active areas spaced apart from each other and a first non-active area surrounding the first active areas are defined in a plane, forming an adhesive layer on the first substrate where the adhesive layer is disposed within the first active areas, disposing a second substrate in which a plurality of second active areas spaced apart from each other and a second non-active area surrounding the second active areas are defined in the plane, and cutting a cutting line of the second substrate, which corresponds to a boundary between the second active areas and the second non-active area, using a laser beam. The adhesive layer does not overlap the cutting line of the second substrate.

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