公开(公告)号：US20140048829A1

公开(公告)日：2014-02-20

申请号：US13746397

申请日：2013-01-22

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Hyun-Eok SHIN ,  Dae-Woo LEE ,  Won-Pil LEE ,  Ho-Jin YOON ,  Yong-Woo PARK ,  Kyung-Min CHOI

IPC: G02B1/00 ,  H01L33/44

CPC classification number: G02B1/00 ,  G02B5/206 ,  G02F1/136209 ,  H01L27/3244 ,  H01L27/3272 ,  H01L33/44 ,  H01L51/5284 ,  H01L2924/0002 ,  Y10T428/24942 ,  Y10T428/24975 ,  H01L2924/00

Abstract: A light blocking member including a metal particle and a ceramic material and a display device including the same.

Abstract translation: 包括金属颗粒和陶瓷材料的遮光构件和包括该遮光构件的显示装置。

公开(公告)号：US20150187849A1

公开(公告)日：2015-07-02

申请号：US14520518

申请日：2014-10-22

Applicant: Samsung Display Co., Ltd.

Inventor： Hayk KACHATRYAN ,  Hyun-Woo KOO ,  Kyung-Min CHOI

IPC: H01L27/32 ,  H01L51/00 ,  H01L27/12 ,  H01L51/56

CPC classification number: H01L27/1274 ,  H01L27/1218 ,  H01L27/1266 ,  H01L51/0097 ,  H01L51/56 ,  H01L2227/326 ,  H01L2251/5338 ,  H01L2251/556

Abstract: In a method of manufacturing a flexible substrate, a preliminary sacrificial layer that includes polyimide is formed on a carrier substrate. The preliminary sacrificial layer is transformed into a sacrificial layer that includes a modified polyimide. A base substrate layer that includes polyimide is formed on the sacrificial layer. A device structure is formed on the base substrate layer. A combination of the base substrate layer and the device structure is separated from the carrier substrate.

Abstract translation: 在柔性基板的制造方法中，在载体基板上形成包含聚酰亚胺的预备牺牲层。 将预牺牲层转变成包括改性聚酰亚胺的牺牲层。 在牺牲层上形成包含聚酰亚胺的基底层。 在基底层上形成器件结构。 基底衬底层和器件结构的组合与载体衬底分离。