RESIN COMPOSITION, ADHESIVE MEMBER, AND DISPLAY DEVICE

    公开(公告)号:US20230322995A1

    公开(公告)日:2023-10-12

    申请号:US18335387

    申请日:2023-06-15

    CPC classification number: C08F283/008 C09J151/08

    Abstract: A resin composition has a viscosity of equal to or less than about 20 mPa·s at a temperature in a range of about 30° C. to about 50° C. as measured according to JIS Z8803, a storage modulus in a range of about 1.7×105 Pa to about 3×105 Pa at about −20° C., and a storage modulus in a range of about 1.5×104 Pa to about 6×104 Pa at about 25° C. An adhesive member formed of the resin composition is also provided.

    RESIN COMPOSITION AND DISPLAY DEVICE INCLUDING ADHESIVE MEMBER FORMED FROM THE RESIN COMPOSITION

    公开(公告)号:US20230164252A1

    公开(公告)日:2023-05-25

    申请号:US17872309

    申请日:2022-07-25

    CPC classification number: H04M1/0268 C09J133/08 H04M1/0216

    Abstract: A resin composition includes at least one (meth)acrylate monomer, a plurality of bifunctional urethane (meth)acrylates, and at least one photoinitiator. The plurality of bifunctional urethane (meth)acrylates includes a first bifunctional urethane (meth)acrylate having a first weight average molecular weight, and a second bifunctional urethane (meth)acrylate having a second weight average molecular weight that is higher than the first weight average molecular weight. A first weight of the first bifunctional urethane (meth)acrylate is greater than or equal to a second weight of the second bifunctional urethane (meth)acrylate with respect to a total weight of the resin composition.

    RESIN COMPOSITION, ADHESIVE MEMBER, AND DISPLAY DEVICE

    公开(公告)号:US20220144992A1

    公开(公告)日:2022-05-12

    申请号:US17371341

    申请日:2021-07-09

    Abstract: A resin composition has a viscosity of equal to or less than about 20 mPa·s at a temperature in a range of about 30° C. to about 50° C. as measured according to JIS Z8803, a storage modulus in a range of about 1.7×105 Pa to about 3×105 Pa at about −20° C., and a storage modulus in a range of about 1.5×104 Pa to about 6×104 Pa at about 25° C. An adhesive member formed of the resin composition is also provided.

Patent Agency Ranking