Abstract:
A display device may include a pixel, a chip pad spaced apart from the pixel, a film pad spaced apart from the chip pad, a wiring connecting the chip pad and the film pad and including a first wiring layer and a second wiring layer disposed on the first wiring layer, and an organic insulation layer covering the chip pad and the wiring. A first groove may be defined in the second wiring layer, and a second groove corresponding to the first groove may be defined in the organic insulation layer.
Abstract:
A repairing method of an organic light emitting display device includes insulating a first switching element and an organic light emitting layer of a defective pixel from each other, short-circuiting a first dummy line and the organic emission layer at a first location, the first dummy line being adjacent to the defective pixel among a plurality of dummy lines extending in a first direction, short-circuiting the first dummy line and a second switching element at a second location, the second switching element being a dummy element prior to the short-circuiting, and insulating an inner side of the first dummy line and an outer side of the first dummy line from each other.
Abstract:
A display device includes: a light-emitting element at a display area; a driving element electrically connected to the light-emitting element; an encapsulation layer covering the light-emitting element; a touch sensor on the encapsulation layer; a connection pad at a bonding area, the connection pad including a lower conductive layer, an intermediate conductive layer on the lower conductive layer, and an upper conductive layer on the intermediate conductive layer; a cladding layer covering at least a side surface of the intermediate conductive layer and including an organic material; a passivation layer covering an upper surface of the cladding layer and including an inorganic material, a portion of the passivation layer being located under the upper conductive layer; and a driving circuit attached to the connection pad.
Abstract:
An organic light emitting device includes a substrate including a display unit configured to display an image and a peripheral portion surrounding the display unit, a plurality of scan lines on the substrate and extending in a first direction, a plurality of data lines on the substrate and intersecting the scan lines in a second direction, a plurality of pixels at the display unit and connected to the scan lines and the data lines, a repair ring surrounding the display unit, a plurality of driving pads on the peripheral portion and connected to ends of the plurality of data lines, a pair of dummy driving pads on the peripheral portion and connected to ends of the repair ring, and a driving circuit configured to transmit a data signal to the plurality of driving pads and to the pair of dummy driving pads.
Abstract:
A display device includes: a light-emitting element at a display area; a driving element electrically connected to the light-emitting element; an encapsulation layer covering the light-emitting element; a touch sensor on the encapsulation layer; a connection pad at a bonding area, the connection pad including a lower conductive layer, an intermediate conductive layer on the lower conductive layer, and an upper conductive layer on the intermediate conductive layer; a cladding layer covering at least a side surface of the intermediate conductive layer and including an organic material; a passivation layer covering an upper surface of the cladding layer and including an inorganic material, a portion of the passivation layer being located under the upper conductive layer; and a driving circuit attached to the connection pad.
Abstract:
A display device includes a light-emitting element disposed in a display area. A connection pad is disposed in a bonding area of a non-display area. The connection pad includes a lower conductive layer, an intermediate conductive layer disposed on the lower conductive layer and an upper conductive layer disposed on the intermediate conductive layer. A lower surface of the upper conductive layer directly contacts an upper surface of the intermediate conductive layer without an intermediate member disposed therebetween.