公开(公告)号：US11273523B2

公开(公告)日：2022-03-15

申请号：US15708927

申请日：2017-09-19

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Sungyong Lee ,  Jaeha Lim ,  Gyoowan Han

IPC: B23K26/38 ,  B08B5/04 ,  B25B11/00 ,  B23K26/70 ,  B08B15/00 ,  B23K26/16 ,  B23K37/04

Abstract: A work table for laser processing includes an upper plate including a plurality of cell regions and at least one groove region that divides the plurality of cell regions. The upper plate includes a plurality of absorption holes that fix a substrate in the plurality of cell regions. A plurality of suction holes collect particles generated during a cutting process performed on the substrate. A lower plate is disposed under the upper plate. The lower plate forms an absorption path that is coupled to the plurality of absorption holes. A suction path is coupled to the plurality of suction holes by combining the lower plate with the upper plate.

公开(公告)号：US12172237B2

公开(公告)日：2024-12-24

申请号：US17650051

申请日：2022-02-04

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Sungyong Lee ,  Jaeha Lim ,  Gyoowan Han

IPC: B23K26/38 ,  B08B5/04 ,  B08B15/00 ,  B23K26/16 ,  B23K26/70 ,  B23K37/04 ,  B25B11/00

Abstract: A work table for laser processing includes an upper plate including a plurality of cell regions and at least one groove region that divides the plurality of cell regions. The upper plate includes a plurality of absorption holes that fix a substrate in the plurality of cell regions. A plurality of suction holes collect particles generated during a cutting process performed on the substrate. A lower plate is disposed under the upper plate. The lower plate forms an absorption path that is coupled to the plurality of absorption holes. A suction path is coupled to the plurality of suction holes by combining the lower plate with the upper plate.

公开(公告)号：US20220152745A1

公开(公告)日：2022-05-19

申请号：US17650051

申请日：2022-02-04

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Sungyong Lee ,  Jaeha Lim ,  Gyoowan Han

IPC: B23K26/38 ,  B08B5/04 ,  B25B11/00 ,  B23K26/70 ,  B08B15/00 ,  B23K26/16 ,  B23K37/04

Abstract: A work table for laser processing includes an upper plate including a plurality of cell regions and at least one groove region that divides the plurality of cell regions. The upper plate includes a plurality of absorption holes that fix a substrate in the plurality of cell regions. A plurality of suction holes collect particles generated during a cutting process performed on the substrate. A lower plate is disposed under the upper plate. The lower plate forms an absorption path that is coupled to the plurality of absorption holes. A suction path is coupled to the plurality of suction holes by combining the lower plate with the upper plate.

公开(公告)号：US20180154485A1

公开(公告)日：2018-06-07

申请号：US15708927

申请日：2017-09-19

Applicant: Samsung Display Co., Ltd.

Inventor： Sungyong Lee ,  Jaeha Lim ,  Gyoowan Han

IPC: B23K26/38 ,  B25B11/00 ,  B08B5/04

CPC classification number: B23K26/38 ,  B08B5/04 ,  B08B15/00 ,  B23K26/16 ,  B23K26/702 ,  B23K37/0408 ,  B25B11/005

Abstract: A work table for laser processing includes an upper plate including a plurality of cell regions and at least one groove region that divides the plurality of cell regions. The upper plate includes a plurality of absorption holes that fix a substrate in the plurality of cell regions. A plurality of suction holes collect particles generated during a cutting process performed on the substrate. A lower plate is disposed under the upper plate. The lower plate forms an absorption path that is coupled to the plurality of absorption holes. A suction path is coupled to the plurality of suction holes by combining the lower plate with the upper plate.