公开(公告)号：US20240114719A1

公开(公告)日：2024-04-04

申请号：US18526676

申请日：2023-12-01

Applicant: Samsung Display Co., LTD.

Inventor： DAEHWAN JANG ,  SUNGHOON KIM ,  HYUK-HWAN KIM ,  SEOKHYUN NAM ,  HAENGWON PARK ,  JIN HO CHO

IPC: H10K50/87 ,  H10K50/115 ,  H10K59/38 ,  H10K71/00

CPC classification number: H10K50/87 ,  H10K50/115 ,  H10K59/38 ,  H10K71/00

Abstract: A display device includes a first substrate including at least one first opening part defined, a pixel disposed on the first substrate, at least one first heat dissipation layer disposed in the at least one first opening part, an insulation layer disposed under the first substrate and including at least one second opening part overlapping the at least one first opening part, and a second heat dissipation layer disposed in the at least one second opening part.

公开(公告)号：US20220028953A1

公开(公告)日：2022-01-27

申请号：US17235224

申请日：2021-04-20

Applicant: Samsung Display Co., Ltd.

Inventor： DAEHWAN JANG ,  YUNJONG YEO ,  JAEBEEN LEE ,  SUNGWON CHO ,  JIN HO CHO

IPC: H01L27/32 ,  H01L51/52 ,  G09G3/3225 ,  H01L51/56

Abstract: A display panel includes a pad line disposed on a rear surface of a base layer and a connection line disposed on a front surface of the base layer. The pad line and the connection line are connected in an area overlapping a pad hole defined to pass through the base layer, and the pad line is connected to a driving unit on the rear surface of the base layer.

公开(公告)号：US20210384457A1

公开(公告)日：2021-12-09

申请号：US17172762

申请日：2021-02-10

Applicant: Samsung Display Co., LTD.

Inventor： DAEHWAN JANG ,  SUNGHOON KIM ,  HYUK-HWAN KIM ,  SEOKHYUN NAM ,  HAENGWON PARK ,  JIN HO CHO

IPC: H01L51/52 ,  H01L27/32 ,  H01L51/50 ,  H01L51/56

Abstract: A display device includes a first substrate including at least one first opening part defined, a pixel disposed on the first substrate, at least one first heat dissipation layer disposed in the at least one first opening part, an insulation layer disposed under the first substrate and including at least one second opening part overlapping the at least one first opening part, and a second heat dissipation layer disposed in the at least one second opening part.