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公开(公告)号:US20180254433A1
公开(公告)日:2018-09-06
申请号:US15840449
申请日:2017-12-13
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor: Chul Hyun CHOI , Ji Hye MOON , Sun A YANG , Hyuk Sang JUN
IPC: H01L51/52
CPC classification number: H01L51/5253 , H01L27/3244 , H01L2251/558
Abstract: A display device includes: a substrate on which a display area and a non-display area are defined; a plurality of pixels disposed on the substrate in the display area; and an encapsulation layer disposed on the pixels to cover the pixels, where the encapsulation layer including a first region and a second region different from the first region. The encapsulation layers has a thickness in a range of 1.75 μm to 4.0 μm, and the ratio of a thickness of the second region of the encapsulation layer to a thickness of the first region of the encapsulation layer is in a range of 0.95 to 1.0.
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公开(公告)号:US20220140290A1
公开(公告)日:2022-05-05
申请号:US17452546
申请日:2021-10-27
Applicant: Samsung Display Co., Ltd.
Inventor: Chul Hyun CHOI , Min Jae KIM , Kyung Hee LEE , Suk Jin LEE , In Hwa LEE , Hyuk Sang JUN
Abstract: A display device includes a substrate; a light-emitting element on the substrate; a capping layer on the light-emitting element; a first inorganic encapsulation layer on the capping layer; an organic encapsulation layer on the first inorganic encapsulation layer; and a second inorganic encapsulation layer on the organic encapsulation layer. The first inorganic encapsulation layer includes a first sub-inorganic encapsulation layer between the capping layer and the organic encapsulation layer, and a second sub-inorganic encapsulation layer between the first sub-inorganic encapsulation layer and the organic encapsulation layer.
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公开(公告)号:US20190043929A1
公开(公告)日:2019-02-07
申请号:US15939208
申请日:2018-03-28
Applicant: Samsung Display Co., Ltd.
Inventor: Chul Hyun CHOI , Hyun Shik LEE , Hyuk Sang JUN
CPC classification number: H01L27/3206 , H01L27/3244 , H01L33/40 , H01L33/52 , H01L51/0081 , H01L51/5203 , H01L51/5237 , H01L51/5253 , H01L51/5275 , H01L2251/558
Abstract: A light-emitting diode according to an exemplary embodiment includes: a first electrode; a second electrode overlapping the first electrode; an emission layer positioned between the first electrode and the second electrode; and a first capping layer positioned on the first electrode, wherein the first capping layer includes at least one among LiF, MgF2, AlF3, NaF, and AlOx, and a thickness of the first capping layer is 30 nm to 40 nm.
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