ELECTRONIC PANEL AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20200075684A1

    公开(公告)日:2020-03-05

    申请号:US16440788

    申请日:2019-06-13

    Abstract: An electronic device includes an electronic panel including an active area and a pad area and including an input sensing member and a circuit board overlapping at least a side of the pad area. The electronic panel includes a first conductive layer, a second conductive layer, a first organic insulation layer disposed between the first conductive layer and the second conductive layer, a pattern layer disposed on the second conductive layer, overlapping the plurality of second conductive patterns, and including a plurality of organic patterns, and a second organic insulation layer covering the pattern layer and the second conductive layer. The pattern layer covers an upper surface of the second conductive layer.

    ELECTRONIC PANEL AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20210175293A1

    公开(公告)日:2021-06-10

    申请号:US17182042

    申请日:2021-02-22

    Abstract: An electronic device includes an electronic panel including an active area and a pad area and including an input sensing member and a circuit board overlapping at least a side of the pad area. The electronic panel includes a first conductive layer, a second conductive layer, a first organic insulation layer disposed between the first conductive layer and the second conductive layer, a pattern layer disposed on the second conductive layer, overlapping the plurality of second conductive patterns, and including a plurality of organic patterns, and a second organic insulation layer covering the pattern layer and the second conductive layer. The pattern layer covers an upper surface of the second conductive layer.

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