SUBSTRATE LOADING DEVICE AND SUBSTRATE LOADING METHOD USING THE SAME

    公开(公告)号:US20240096679A1

    公开(公告)日:2024-03-21

    申请号:US18469684

    申请日:2023-09-19

    CPC classification number: H01L21/6833 H01L21/682

    Abstract: A substrate loading device includes an electrostatic chuck that chucks a substrate, a mask frame disposed under the electrostatic chuck, and including an edge having a flat top surface, and a plurality of holders disposed between the electrostatic chuck and the mask frame. Each of the plurality of holders includes a first connection part connected to a side of the electrostatic chuck, a second connection part connected to the first connection part and extending in a direction intersecting an extension direction of the first connection part, and a third connection part connected to the second connection part, extending in a direction intersecting an extension direction of the second connection part, and rotationally moving between a first position overlapping the substrate in a thickness direction of the substrate and a second position spaced apart from the substrate.

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