Abstract:
A manufacturing method of a thin film transistor array panel includes forming a gate line, forming a gate insulating layer on the gate line, forming a data line including a drain electrode on the gate insulating layer, forming a passivation layer on the gate insulating layer, the data line, and the drain electrode, forming a negative photosensitive organic layer on the passivation layer, heat treating the negative photosensitive organic layer to form an insulating layer including a first portion, and a second portion that is thinner than the first portion, and forming a pixel electrode, a first contact assistant, and a second contact assistant on the insulating layer. The pixel electrode is disposed on the first portion, the first and second contact assistants are disposed on the second portion, and the thickness of the second portion is less than about 1.5 micrometers (μm).
Abstract:
A method of forming a metal pattern is disclosed. In the method, a metal layer is formed on a base substrate. A photoresist composition is coated on the metal layer to form a coating layer. The photoresist composition includes a binder resin, a photo-sensitizer and a mixed solvent including a first solvent, a second solvent having a higher volatility than the first solvent, and a third solvent having a higher volatility than the second solvent. The coating layer is exposed to light. The coating layer is partially removed to form a photoresist pattern. The metal layer is patterned by using the photoresist pattern as a mask.
Abstract:
A thin film transistor substrate is provided. The thin film transistor substrate includes a display area including a plurality of pixels, wherein the pixels are connected to gate lines and data lines, a gate driver connected to the gate lines, a plurality of data pads connected to the data lines, a plurality of dummy pattern parts formed of a same layer as the gate lines, and a non-display area in which the gate driver, data pads, and dummy pattern parts are disposed, and the dummy pattern parts are disposed in an area within the non-display area where the gate driver is not disposed, and one of the dummy pattern parts is disposed overlapping with the data pads.