公开(公告)号：US20210249603A1

公开(公告)日：2021-08-12

申请号：US16988954

申请日：2020-08-10

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Se Il KIM ,  Sang Min YI ,  Eui Gyu KIM ,  Dae Won BAEK

IPC: H01L51/00 ,  H01L51/56 ,  C23C14/04 ,  C23C14/24

Abstract: A mask assembly and method for manufacturing of the same are provided. A mask assembly includes: a mask frame including a first mask opening and a second mask opening which are located side by side in a first direction and defined by a support bar; a first split mask overlapping the first mask opening; and a second split mask overlapping the second mask opening, and the first split mask and the second split mask are spaced apart from each other in a region overlapping the support bar.

公开(公告)号：US20240060172A1

公开(公告)日：2024-02-22

申请号：US18203702

申请日：2023-05-31

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jun Hyeuk KO ,  Jae Suk MOON ,  Min Goo KANG ,  Eui Gyu KIM ,  Min Chul SONG ,  Suk Ha RYU ,  Young Sun CHO

IPC: C23C14/50 ,  C23C14/04 ,  C23C14/24

CPC classification number: C23C14/50 ,  C23C14/042 ,  C23C14/24

Abstract: A deposition apparatus for depositing a deposition material on a base substrate disposed on a mask, includes: a mask assembly including a mask frame which defines an opening therein and surrounds the opening, and the mask disposed on the mask frame; an electrostatic chuck disposed on the base substrate; and a plate disposed on the electrostatic chuck. The electrostatic chuck includes a plurality of magnetic bodies, and a magnetic property of at least one magnetic body among the plurality of magnetic bodies is different from a magnetic property of remaining magnetic bodies except for the at least one magnetic body among the plurality of magnetic bodies.

公开(公告)号：US20230240124A1

公开(公告)日：2023-07-27

申请号：US18192468

申请日：2023-03-29

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Se Il KIM ,  Sang Min YI ,  Eui Gyu KIM ,  Dae Won BAEK

IPC: H10K71/16 ,  C23C14/24 ,  C23C14/04 ,  H10K71/00

CPC classification number: H10K71/166 ,  C23C14/24 ,  C23C14/042 ,  H10K71/00 ,  H10K71/164

Abstract: A mask assembly and method for manufacturing of the same are provided. A mask assembly includes: a mask frame including a first mask opening and a second mask opening which are located side by side in a first direction and defined by a support bar; a first split mask overlapping the first mask opening; and a second split mask overlapping the second mask opening, and the first split mask and the second split mask are spaced apart from each other in a region overlapping the support bar.

公开(公告)号：US20240322713A1

公开(公告)日：2024-09-26

申请号：US18396845

申请日：2023-12-27

Applicant: Samsung Display Co., LTD.

Inventor： MINCHUL SONG ,  MINGOO KANG ,  JUNHYEUK KO ,  Eui Gyu KIM ,  Sukha RYU ,  SANGHEON JEON

IPC: H02N13/00 ,  B05C13/00 ,  B05C21/00

CPC classification number: H02N13/00 ,  B05C13/00 ,  B05C21/005

Abstract: A thin film deposition apparatus according to an embodiment includes a chamber, a deposition source disposed in a chamber and that supplies a deposition material to the substrate, a mask assembly comprising pattern holes through which the deposition material passes, and an electrostatic chuck facing the mask assembly and that fixes the substrate. The electrostatic chuck comprises a body that supports the substrate, an insulating layer disposed on the body, a first electrode disposed in the insulating layer and spaced apart from the body by a first distance, a second electrode disposed in the insulating layer and spaced apart from the body by a second distance, and a conductive layer disposed in the insulating layer and spaced apart from the body by a third distance. The first electrode and the second electrode are supplied with different voltages, and the third distance is greater than the first distance.

公开(公告)号：US20240039431A1

公开(公告)日：2024-02-01

申请号：US18107049

申请日：2023-02-08

Applicant: Samsung Display Co., LTD.

Inventor： Jun Hyeuk KO ,  Min Goo KANG ,  Suk Ha RYU ,  Min Seok KIM ,  Eui Gyu KIM ,  Min Chul SONG ,  Young Sun CHO

IPC: H02N13/00 ,  C23C14/04 ,  C23C14/50

CPC classification number: H02N13/00 ,  C23C14/042 ,  C23C14/50

Abstract: A deposition apparatus includes a plate; electrostatic chucks including a first surface on which the plate is disposed; and a second surface on which a substrate is supported; and a control device that controls a flatness between the electrostatic chucks, and each of the electrostatic chucks includes driving shafts disposed through an area of an edge of the first surface of each of the electrostatic chucks, and the control device controls the flatness between the electrostatic chucks through the driving shafts by measuring a height deviation between the electrostatic chucks.