公开(公告)号：US11206744B2

公开(公告)日：2021-12-21

申请号：US16721047

申请日：2019-12-19

申请人： SZ DJI OSMO TECHNOLOGY CO., LTD.

发明人： Ping Wang ,  Ting Wang ,  Yongjie Huang

IPC分类号： H05K7/20 ,  H04N5/225 ,  H05K5/02

摘要： The embodiments of the present disclosure provide a heat dissipation structure, applied to an electronic device. The electronic device includes a power consumption element, and the power consumption element disposed in an accommodation cavity. The heat dissipation structure includes a cover, configured to cover and seal the accommodation cavity. The cover is thermally connected to the power consumption element through a heat-conducting element. The heat dissipation structure further includes a heat-dissipation component, thermally connected to the cover and including a heat-dissipation module and a fan. The heat-dissipation module is disposed in an air outlet channel of the fan, such that the wind generated by the fan takes away the heat of the heat-dissipation module.