公开(公告)号：US20170182541A1

公开(公告)日：2017-06-29

申请号：US15156460

申请日：2016-05-17

Applicant: SUNGWOO HITECH CO. LTD.

Inventor： Sanghyun PARK ,  Rae Hyeong KIM ,  Mun Yong LEE

IPC: B21D26/027 ,  B21D26/055 ,  B21D26/031

CPC classification number: B21D26/027 ,  B21D26/031 ,  B21D26/055

Abstract: A multi-forming device is disclosed. A multi-forming device according to an exemplary embodiment of the present invention may include: a lower mold die; a lower mold that is disposed at a center upper surface of the lower mold die, in which a gas passage is formed in an up-and-down direction to receive a shaping gas from an outside gas supplier device, in which a lower mold surface is formed at an upper surface thereof, and in which a plurality of heating cartridges are disposed therein along the lower surface thereof; an upper mold that is disposed on an upper side slider to be moved in an up-and-down direction corresponding to the lower mold, in which an upper mold surface is formed at a lower surface corresponding to the lower mold, in which an upper mold face is formed at a circumference of the upper mold surface, and in which a plurality of heating cartridges are disposed along the upper mold surface; a blank holder through which the lower mold is inserted and that is disposed to move in an up-and-down direction through a cushion spring on the lower mold die, and in which a holder face is formed to grasp a material together with the upper mold face at an early stage of a forming process; an inner gas pipe that is disposed in a gas passage of the lower mold; and a switch valve that switches supply passages of the shaping gas that is supplied to the inner gas pipe and the gas passage.