-
公开(公告)号：US20210280502A1
公开(公告)日：2021-09-09
申请号：US17165492
申请日：2021-02-02
Applicant: STMicroelectronics SDN BHD
Inventor： Yh HENG
IPC: H01L23/495 , H01L21/56
Abstract: A frame includes leadframe units arranged in a matrix. Each leadframe unit has a die pad and tie bars connected to and extending from the die pad. Each tie bar includes an internal tie bar portion and an external tie bar portion. The internal tie bar portion of at least one tie bar includes a cut separating a part of the internal tie bar portion from the external tie bar portion. An out-of-plane bend in that part forms a mold flow control structure.
Search Results
1
records
(took 0.007 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
