公开(公告)号：US11990442B2

公开(公告)日：2024-05-21

申请号：US17537112

申请日：2021-11-29

Applicant: STMicroelectronics S.r.l.

Inventor： Cristina Somma ,  Aurora Sanna ,  Damian Halicki

IPC: H01L23/00 ,  H01L23/498

CPC classification number: H01L24/16 ,  H01L23/49838 ,  H01L24/17 ,  H01L2224/16225 ,  H01L2224/1713 ,  H01L2924/30101

Abstract: A semiconductor die is mounted at a die area of a ball grid array package that includes an array of electrically-conductive ball. A power channel conveys a power supply current to the semiconductor die. The power channel is formed by an electrically-conductive connection plane layers extending in a longitudinal direction between a distal end at a periphery of the package and a proximal end at the die area. A distribution of said electrically-conductive balls is made along the longitudinal direction. The electrically-conductive connection plane layer includes subsequent portions in the longitudinal direction between adjacent electrically-conductive balls of the distribution. Respective electrical resistance values of the subsequent portions monotonously decrease from the distal end to the proximal end. A uniform distribution of power supply current over the length of the power channel is thus facilitated.