公开(公告)号：US20030222354A1

公开(公告)日：2003-12-04

申请号：US10406633

申请日：2003-04-02

Applicant: STMicroelectronics S.r.I.

Inventor： Ubaldo Mastromatteo ,  Paolo Ferrari

IPC: H01L029/00 ,  H01L029/40 ,  H01L021/4763 ,  H01L021/44 ,  H01L023/04 ,  H01L023/48 ,  H01L023/52

CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05572 ,  H01L2224/13025 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/1461 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552

Abstract: The process for manufacturing a through insulated interconnection is performed by forming, in a body of semiconductor material, a trench extending from the front (of the body for a thickness portion thereof; filling the trench with dielectric material; thinning the body starting from the rear until the trench, so as to form an insulated region surrounded by dielectric material; and forming a conductive region extending inside said insulated region between the front and the rear of the body and having a higher conductivity than the first body. The conductive region includes a metal region extending in an opening formed inside the insulated region or of a heavily doped semiconductor region, made prior to filling of the trench.

Abstract translation: 通过绝缘互连制造的方法是通过在半导体材料体中形成从前部（其主体的厚度部分）延伸的沟槽;用电介质材料填充沟槽;从后面开始使身体变薄 直到形成由电介质材料包围的绝缘区域，形成在主体前后的绝缘区域内延伸的导电性区域，并具有比第1主体高的导电性，导电区域包括： 金属区域在形成在绝缘区域内的开口中延伸，或者在填充沟槽之前制成的重掺杂半导体区域。

公开(公告)号：US20040070888A1

公开(公告)日：2004-04-15

申请号：US10601332

申请日：2003-06-20

Applicant: STMicroelectronics S.r.I.

Inventor： Ubaldo Mastromatteo ,  Bruno Murari ,  Paolo Ferrari ,  Simone Sassolini

IPC: G11B005/56

CPC classification number: B81B3/0021 ,  H02N1/006

Abstract: A micro-electro-mechanical device formed by a body of semiconductor material having a thickness and defining a mobile part and a fixed part. The mobile part is formed by a mobile platform, supporting arms extending from the mobile platform to the fixed part, and by mobile electrodes fixed to the mobile platform. The fixed part has fixed electrodes facing the mobile electrodes, a first biasing region fixed to the fixed electrodes, a second biasing region fixed to the supporting arms, and an insulation region of insulating material extending through the entire thickness of the body. The insulation region insulates electrically at least one between the first and the second biasing regions from the rest of the fixed part.

Abstract translation: 由具有厚度并限定可移动部分和固定部分的半导体材料体形成的微电子机械装置。 可移动部分由移动平台，从移动平台延伸到固定部分的支撑臂，以及固定到移动平台的移动电极形成。 固定部分具有面向移动电极的固定电极，固定到固定电极的第一偏置区域，固定到支撑臂的第二偏压区域以及延伸穿过主体整个厚度的绝缘材料的绝缘区域。 绝缘区域在第一和第二偏压区域之间至少一个与固定部件的其余部分绝缘。