公开(公告)号：US20160172273A1

公开(公告)日：2016-06-16

申请号：US14565686

申请日：2014-12-10

Applicant: STMICROELECTRONICS SDN BHD

Inventor： Cheeyang NG

IPC: H01L23/495 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49541 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49575 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48245 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/14 ,  H01L2924/1711 ,  H01L2924/17738 ,  H01L2924/17747 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/20643 ,  H01L2924/20644 ,  H01L2924/20645 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit (IC) device includes an IC die and a plurality of leads. Each lead includes an unplated proximal end including a first material, and an unplated distal end including the first material. A plated bond wire portion extends between the proximal and distal ends and includes the first material and a plating of a second material thereon. A plurality of bond wires extend between the IC die and the plated bond wire portions of the leads. An encapsulation material surrounds the IC die and bond wires so that the unplated proximal end and plated bond wire portion of each lead are covered by the encapsulation material.

Abstract translation: 集成电路（IC）装置包括IC管芯和多个引线。 每个引线包括包括第一材料的未镀层近端和包括第一材料的未镀层远端。 电镀接合线部分在近端和远端之间延伸并且包括第一材料和其上的第二材料的镀覆。 多个接合线在IC管芯和引线的电镀接合线部分之间延伸。 封装材料围绕IC管芯和接合线，使得每个引线的未镀层的近端和电镀接合线部分被封装材料覆盖。