公开(公告)号：US20240179475A1

公开(公告)日：2024-05-30

申请号：US18513248

申请日：2023-11-17

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Domenico GIUSTI ,  Fabio QUAGLIA ,  Marco FERRERA ,  Carlo Luigi PRELINI ,  Alessandro Stuart SAVOIA

IPC: H04R17/02 ,  H04R31/00

CPC classification number: H04R17/02 ,  H04R31/006 ,  H04R2201/003 ,  H04R2400/01

Abstract: MEMS device comprising: a signal processing assembly; a transduction module comprising a plurality of transducer devices; a stiffening structure at least partially surrounding each transducer device; one or more coupling pillars for each transducer device, extending on the stiffening structure and configured to physically and electrically couple the transduction module to the signal processing assembly, to carry control signals of the transducer devices. Each conductive coupling element has a section having a shape such as to maximize the overlapping surface with the stiffening structure around the respective transducer device. This shape includes hypocycloid with a number of cusps equal to or greater than three; triangular; quadrangular.

公开(公告)号：US20220169497A1

公开(公告)日：2022-06-02

申请号：US17538845

申请日：2021-11-30

Applicant: STMICROELECTRONICS S.r.l.

Inventor： Alessandro Stuart SAVOIA ,  Domenico GIUSTI ,  Marco FERRERA ,  Fabio QUAGLIA

IPC: B81B3/00 ,  H01L41/047 ,  H01L41/083

Abstract: A micromechanical device for transducing acoustic waves in a propagation medium, comprising: a body; a first electrode structure superimposed to the body and electrically insulated from the body, the first electrode structure and the body defining between them a first buried cavity; and a first piezoelectric element superimposed to the first electrode structure, wherein the body, the first electrode structure, and the buried cavity form a first capacitive ultrasonic transducer, and the first electrode structure and the first piezoelectric element form a first piezoelectric ultrasonic transducer.