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公开(公告)号：US11305534B2
公开(公告)日：2022-04-19
申请号：US16945465
申请日：2020-07-31
Applicant: STMICROELECTRONICS INTERNATIONAL N.V.
Inventor： Simon Dodd , David S. Hunt , Joseph Edward Scheffelin , Dana Gruenbacher , Stefan H. Hollinger , Uwe Schober , Peter Janouch
Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.
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公开(公告)号：US10646892B2
公开(公告)日：2020-05-12
申请号：US15803630
申请日：2017-11-03
Applicant: STMicroelectronics, Inc. , STMICROELECTRONICS S.R.L. , STMicroelectronics International N.V.
Inventor： Simon Dodd , Joe Scheffelin , Dave Hunt , Matt Giere , Dana Gruenbacher , Faiz Sherman
Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
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Patent Agency Ranking
公开(公告)号：US09919334B2
公开(公告)日：2018-03-20
申请号：US14975540
申请日：2015-12-18
Applicant: STMicroelectronics, Inc. , STMICROELECTRONICS S.R.L. , STMicroelectronics International N.V.
Inventor： Simon Dodd , Joe Scheffelin , Dave Hunt , Matt Giere , Dana Gruenbacher , Faiz Sherman
CPC classification number: B05B17/0607 , B05B17/0638 , B05B17/0684 , B41J2/14016 , B41J2/14024 , B41J2/14056 , B41J2/14072 , B41J2/1433 , B41J2/1601 , B41J2/1632 , B41J2/175 , B41J2/17526 , B41J2/1753 , B41J2002/14338 , B41J2002/14491 , H05K1/0212 , H05K1/111 , H05K1/181 , Y10T29/49119
Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
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公开(公告)号：US09833806B2
公开(公告)日：2017-12-05
申请号：US14976434
申请日：2015-12-21
Applicant: STMicroelectronics, Inc. , STMICROELECTRONICS S.R.L. , STMicroelectronics International N.V.
Inventor： Simon Dodd , Joe Scheffelin , Dave Hunt , Matt Giere , Dana Gruenbacher , Faiz Sherman
CPC classification number: B05B17/0607 , B05B17/0638 , B05B17/0684 , B41J2/14016 , B41J2/14024 , B41J2/14056 , B41J2/14072 , B41J2/1433 , B41J2/1601 , B41J2/1632 , B41J2/175 , B41J2/17526 , B41J2/1753 , B41J2002/14338 , B41J2002/14491 , H05K1/0212 , H05K1/111 , H05K1/181 , Y10T29/49119
Abstract: The present disclosure is directed to a microfluidic die that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
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公开(公告)号：US10759168B2
公开(公告)日：2020-09-01
申请号：US16357077
申请日：2019-03-18
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS INTERNATIONAL N.V. , STMICROELECTRONICS S.R.L.
Inventor： Simon Dodd , David S. Hunt , Joseph Edward Scheffelin , Dana Gruenbacher , Stefan H. Hollinger , Uwe Schober , Peter Janouch
Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.
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公开(公告)号：US10543504B2
公开(公告)日：2020-01-28
申请号：US15636491
申请日：2017-06-28
Applicant: STMicroelectronics, Inc. , STMICROELECTRONICS S.R.L. , STMicroelectronics International N.V.
Inventor： Simon Dodd , Joe Scheffelin , Dave Hunt , Matt Giere , Dana Gruenbacher , Faiz Sherman
Abstract: A microfluidic die is disclosed that includes a plurality of heaters above a substrate, a plurality of chambers and nozzles above the heaters, a plurality of first contacts coupled to the heaters, and a plurality of second contacts coupled to the heaters. The plurality of second contacts are coupled to each other and coupled to ground. The die includes a plurality of contact pads, a first signal line coupled to the plurality of second contacts and to a first one of the plurality of contact pads, and a plurality of second signal lines, each second signal line being coupled to one of the plurality of first contacts, groups of the second signal lines being coupled together to drive a group of the plurality of heaters with a single signal, each group of the second signal lines being coupled to a remaining one of the plurality of contact pads.
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公开(公告)号：US10272684B2
公开(公告)日：2019-04-30
申请号：US15253601
申请日：2016-08-31
Applicant: STMICROELECTRONICS, INC. , STMICROELECTRONICS INTERNATIONAL N.V. , STMICROELECTRONICS S.R.L.
Inventor： Simon Dodd , David S. Hunt , Joseph Edward Scheffelin , Dana Gruenbacher , Stefan H. Hollinger , Uwe Schober , Peter Janouch
Abstract: The present disclosure provides supports for microfluidic die that allow for nozzles of the microfluidic die to be on a different plane or face a different direction from electrical contacts on the same support. This includes a rigid support having electrical contacts on a different side of the rigid support with respect to a direction of ejection of the nozzles, and a semi-flexible support or semi-rigid support that allow the electrical contacts to be moved with respect to a direction of ejection of the nozzles. The semi-flexible and semi-rigid supports allow the die to be up to and beyond a 90 degree angle with respect to a plane of the electrical contacts. The different supports allow for a variety of positions of the microfluidic die with respect to a position of the electrical contacts.
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