公开(公告)号：US20240371719A1

公开(公告)日：2024-11-07

申请号：US18311473

申请日：2023-05-03

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： JongChan Park ,  YoungMin Kim ,  TaeKeun Lee

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/42

Abstract: A semiconductor device has an electrical component and a heat sink disposed over the electrical component. The heat sink has a cover with a wall extending from the cover forming a pocket around a perimeter of the electrical component. The heat sink also has a horizontal step, and a riser extending from the horizontal step to the cover. The wall extends from the cover to form the pocket. A TIM is disposed between the cover and a surface of the electrical component. The TIM can be liquid metal. The heat sink is pressed onto the TIM under force and heat to distribute the TIM between the cover and surface of the electrical component. The TIM remains contained within the pocket by the wall. The wall or cover can have a vent hole. The TIM may extend over a side surface of the electrical component.