公开(公告)号：US20240371825A1

公开(公告)日：2024-11-07

申请号：US18646853

申请日：2024-04-26

Applicant: STATS ChipPAC Pte. Ltd.

Inventor： TaeWoo LEE ,  HeeSoo LEE ,  EunHee MYUNG

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/00

Abstract: A semiconductor package and a method for making the same are provided. The semiconductor package may include: a substrate having a first surface and a second surface opposite to the first surface; a first insulating layer disposed on the first surface of the substrate and having a first concave portion; a first semiconductor interposer disposed in the first concave portion of the first insulating layer, the first semiconductor interposer including a first semiconductor layer and a plurality of first wiring patterns formed on the first semiconductor layer; a first electronic component overlapping with a first portion of the first semiconductor interposer and electrically connected with the first wiring patterns of the first semiconductor interposer; and a second electronic component overlapping with a second portion of the first semiconductor interposer and electrically connected with the first wiring patterns of the first semiconductor interposer.