SOLID-STATE IMAGE SENSOR AND ELECTRONIC DEVICE

    公开(公告)号:US20180020169A1

    公开(公告)日:2018-01-18

    申请号:US15544781

    申请日:2016-01-22

    发明人: HIDEAKI MOGI

    IPC分类号: H04N5/33 H01L27/146 H04N5/14

    摘要: The present disclosure relates to a solid-state image sensor and an electronic device capable of simultaneously imaging a subject image and detecting a moving object. A solid-state image sensor according to an aspect of the present disclosure is provided with an infrared light detection unit which outputs a moving object image on the basis of infrared light out of incident light, and a visible light detection unit which outputs a subject image on the basis of visible light out of the incident light, in which the infrared light detection unit and the visible light detection unit are stacked and simultaneously output the moving object image and the subject image with the same frame and the same angle of view. The present disclosure is applicable to, for example, an electronic device having an imaging function for detecting a moving object.

    SOLID-STATE IMAGE SENSOR AND ELECTRONIC APPARATUS

    公开(公告)号:US20220165781A1

    公开(公告)日:2022-05-26

    申请号:US17539552

    申请日:2021-12-01

    IPC分类号: H01L27/146 H04N5/369

    摘要: The present disclosure relates to a solid-state image sensor and an electronic apparatus that suppress a decrease in light collection efficiency and degradation in oblique light resistance and enable a reduction in the height of a solid-state image sensor. A solid-state image sensor according to a first aspect of the present disclosure is a solid-state image sensor of a vertical spectral diffraction type in which a plurality of photoelectric conversion units are stacked in a region of each pixel, the solid-state image sensor including: a first photoelectric conversion module that includes a first photoelectric conversion unit configured to perform photoelectric conversion on light in a first wavelength range of incident light, a first upper electrode and a first lower electrode formed with the first photoelectric conversion unit placed between the first upper electrode and the first lower electrode, and a first spectral correction unit formed between the first upper electrode and the first lower electrode to be stacked on the first photoelectric conversion unit; and a second photoelectric conversion unit configured to perform photoelectric conversion on light in a second wavelength range of light that has passed through the first photoelectric conversion module, the second wavelength range being different from the first wavelength range. The present disclosure can be applied to, for example, a CMOS image sensor.