Headset
    8.
    外观设计
    Headset 有权

    公开(公告)号:USD1029791S1

    公开(公告)日:2024-06-04

    申请号:US29877833

    申请日:2023-06-13

    Abstract: FIG. 1 is a perspective view of the back, top, and left side view of a first embodiment showing the new design;
    FIG. 2 is a perspective view of the back, bottom, and right side view thereof;
    FIG. 3 is a top view thereof;
    FIG. 4 is a bottom view thereof;
    FIG. 5 is a right side elevation view thereof;
    FIG. 6 is a left side elevation view thereof;
    FIG. 7 is a rear elevation view thereof; and,
    FIG. 8 is a front elevation view thereof.
    The short dash broken lines indicate portions of the headset that form no part of the claimed design.

    Electronic components and glasses

    公开(公告)号:US11627399B2

    公开(公告)日:2023-04-11

    申请号:US17646865

    申请日:2022-01-03

    Abstract: The present disclosure relates to electronic components and glasses comprising an electronic component. The electronic component may include a component body, a first circuit board, a second circuit board, a first microphone element, and a second microphone element. The component body may include a cavity. The first circuit board and the second circuit board may be inclined to each arranged in the cavity. The first microphone element may be arranged on a sidewall, facing the component body, of the first circuit board. The second microphone element may be arranged on a sidewall, facing the component body, of the second circuit board. A first sound conducting hole may be arranged on a sidewall, opposite to the first microphone element, of the component body. The first sound conducting hole may be configured to conduct a sound to the first microphone element. A second sound conducting hole may be arranged on the sidewall, opposite to the first microphone element, of the component body. The second sound conducting hole may be configured to conduct a sound to the second microphone element. The present disclosure may make full use of a space of the electronic component. When the electronic component is applied to an electronic device, it is beneficial to the thinness and lightness of the electronic device.

    Electronic components and glasses
    10.
    发明授权

    公开(公告)号:US11272278B2

    公开(公告)日:2022-03-08

    申请号:US17172068

    申请日:2021-02-09

    Abstract: The present disclosure relates to electronic components and glasses comprising an electronic component. The electronic component may include a component body, a first circuit board, a second circuit board, a first microphone element, and a second microphone element. The component body may include a cavity. The first circuit board and the second circuit board may be inclined to each arranged in the cavity. The first microphone element may be arranged on a sidewall, facing the component body, of the first circuit board. The second microphone element may be arranged on a sidewall, facing the component body, of the second circuit board. A first sound conducting hole may be arranged on a sidewall, opposite to the first microphone element, of the component body. The first sound conducting hole may be configured to conduct a sound to the first microphone element. A second sound conducting hole may be arranged on the sidewall, opposite to the first microphone element, of the component body. The second sound conducting hole may be configured to conduct a sound to the second microphone element. The present disclosure may make full use of a space of the electronic component. When the electronic component is applied to an electronic device, it is beneficial to the thinness and lightness of the electronic device.

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