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    ACOUSTIC OUTPUT DEVICES
    2.
    发明申请
    ACOUSTIC OUTPUT DEVICES 有权

    公开(公告)号：US20220369020A1

    公开(公告)日：2022-11-17

    申请号：US17816389

    申请日：2022-07-29

    Applicant: SHENZHEN SHOKZ CO., LTD.

    Inventor： Lei ZHANG ,  Zhen WANG ,  Liwei WANG ,  Peigeng TONG ,  Fengyun LIAO ,  Xin QI ,  Xianwei SHI ,  Shuailin XIE ,  Yunbin CHEN

    IPC: H04R1/10

    Abstract: The present disclosure discloses an acoustic output device. The acoustic output device may include a speaker assembly, configured to convert audio signals into vibration signals; a functional assembly electrically connected to the speaker assembly; and a supporting structure, configured to be connected to the speaker assembly and the functional assembly, wherein the supporting structure includes a metal body therein, and the metal body may be electrically connected to the functional assembly.

    EARPHONES
    5.
    发明申请
    EARPHONES 有权

    公开(公告)号：US20250071464A1

    公开(公告)日：2025-02-27

    申请号：US18943822

    申请日：2024-11-11

    Applicant: SHENZHEN SHOKZ CO., LTD.

    Inventor： Chong WANG ,  Ruixin HAN ,  Gong YUE ,  Yunbin CHEN ,  Zhiqing LIU ,  Jiang XU

    IPC: H04R1/10

    Abstract: The present disclosure mainly relates to an earphone, comprising a core module and a hook structure. The core module is disposed on a front side of an ear in a wearing state. At least a portion of the hook structure is disposed at a rear side of the ear in the wearing state. The core module includes a core housing and a loudspeaker. The hook structure includes an adapter housing connected with the core housing. At least a portion of the adapter housing is disposed at the front side of the ear in the wearing state. The adapter housing forms an accommodation cavity and one or more through holes communicated with the accommodation cavity. The earphone includes one or more electrode terminals at least partially disposed in the one or more through holes.

    CIRCUIT FOR POWER MANAGEMENT
    6.
    发明申请
    CIRCUIT FOR POWER MANAGEMENT 有权

    公开(公告)号：US20220337075A1

    公开(公告)日：2022-10-20

    申请号：US17809010

    申请日：2022-06-27

    Applicant: SHENZHEN SHOKZ CO., LTD.

    Inventor： Yunbin CHEN ,  Fen YOU ,  Xiao ZHANG

    IPC: H02J7/00

    Abstract: The present disclosure relates to a power management circuit of an electronic device. The circuit may include a battery configured to provide a variable current to drive a load device, and a processing circuit electrically connected to the battery via a wire. The processing circuit may be configured to detect a voltage applied on the processing circuit, and power off the load device in response to a detection that the voltage applied on the processing circuit is smaller than a threshold value. The voltage applied on the processing circuit may depend on a cell voltage of the battery, and a voltage drop caused by the variable current and a resistance deriving from the battery and the wire. A change of the voltage applied on the processing circuit may lag behind a change of the variable current.

    ELECTRONIC COMPONENTS AND GLASSES
    8.
    发明公开
    ELECTRONIC COMPONENTS AND GLASSES 审中-公开

    公开(公告)号：US20230247338A1

    公开(公告)日：2023-08-03

    申请号：US18297905

    申请日：2023-04-10

    Applicant: SHENZHEN SHOKZ CO., LTD.

    Inventor： Yueqiang WANG ,  Yongjian LI ,  Yunbin CHEN ,  Haofeng ZHANG

    IPC: H04R1/08 ,  G02C11/00 ,  H04R1/04 ,  H04R1/40 ,  H04R1/46 ,  H04R3/00

    CPC classification number: H04R1/083 ,  G02C11/10 ,  H04R1/04 ,  H04R1/406 ,  H04R1/46 ,  H04R3/005 ,  H04R2460/13

    Abstract: The present disclosure relates to electronic components and glasses comprising an electronic component. The electronic component may include a component body, a first circuit board, a second circuit board, a first microphone element, and a second microphone element. The component body may include a cavity. The first circuit board and the second circuit board may be inclined to each arranged in the cavity. The first microphone element may be arranged on a sidewall, facing the component body, of the first circuit board. The second microphone element may be arranged on a sidewall, facing the component body, of the second circuit board. A first sound conducting hole may be arranged on a sidewall, opposite to the first microphone element, of the component body. The first sound conducting hole may be configured to conduct a sound to the first microphone element. A second sound conducting hole may be arranged on the sidewall, opposite to the first microphone element, of the component body. The second sound conducting hole may be configured to conduct a sound to the second microphone element. The present disclosure may make full use of a space of the electronic component. When the electronic component is applied to an electronic device, it is beneficial to the thinness and lightness of the electronic device.

    ELECTRONIC COMPONENTS AND GLASSES
    9.
    发明申请
    ELECTRONIC COMPONENTS AND GLASSES 有权

    公开(公告)号：US20220132233A1

    公开(公告)日：2022-04-28

    申请号：US17646865

    申请日：2022-01-03

    Applicant: SHENZHEN SHOKZ CO., LTD.

    Inventor： Yueqiang WANG ,  Yongjian LI ,  Yunbin CHEN ,  Haofeng ZHANG

    IPC: H04R1/08 ,  G02C11/00 ,  H04R1/04 ,  H04R1/40 ,  H04R1/46 ,  H04R3/00

    Abstract: The present disclosure relates to electronic components and glasses comprising an electronic component. The electronic component may include a component body, a first circuit board, a second circuit board, a first microphone element, and a second microphone element. The component body may include a cavity. The first circuit board and the second circuit board may be inclined to each arranged in the cavity. The first microphone element may be arranged on a sidewall, facing the component body, of the first circuit board. The second microphone element may be arranged on a sidewall, facing the component body, of the second circuit board. A first sound conducting hole may be arranged on a sidewall, opposite to the first microphone element, of the component body. The first sound conducting hole may be configured to conduct a sound to the first microphone element. A second sound conducting hole may be arranged on the sidewall, opposite to the first microphone element, of the component body. The second sound conducting hole may be configured to conduct a sound to the second microphone element. The present disclosure may make full use of a space of the electronic component. When the electronic component is applied to an electronic device, it is beneficial to the thinness and lightness of the electronic device.

    ACOUSTIC OUTPUT DEVICES
    10.
    发明申请
    ACOUSTIC OUTPUT DEVICES 有权

    公开(公告)号：US20220360873A1

    公开(公告)日：2022-11-10

    申请号：US17814586

    申请日：2022-07-25

    Applicant: SHENZHEN SHOKZ CO., LTD.

    Inventor： Lei ZHANG ,  Zhen WANG ,  Liwei WANG ,  Peigeng TONG ,  Fengyun LIAO ,  Xin QI ,  Xianwei SHI ,  Shuailin XIE ,  Yunbin CHEN

    IPC: H04R1/02

    Abstract: The present disclosure discloses an acoustic output device. The acoustic output device may include a speaker assembly, configured to convert audio signals into vibration signals; a functional assembly electrically connected to the speaker assembly; and a supporting structure, configured to be connected to the speaker assembly and the functional assembly, wherein the supporting structure includes a metal body therein, and the metal body may be electrically connected to the functional assembly.

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