公开(公告)号：US20250133327A1

公开(公告)日：2025-04-24

申请号：US19000773

申请日：2024-12-24

Applicant: SHENZHEN SHOKZ CO., LTD.

Inventor： Junjiang FU ,  Chaowu LI ,  Peigeng TONG

IPC: H04R1/10 ,  H04R9/02 ,  H04R9/06

Abstract: A core module and an electronic device are provided. The core module comprises a housing component, a transducer device, and a vibration panel. The housing component includes a core housing, a core cover plate, and a sealing film. The transducer device includes a support. The core cover plate and the sealing film are respectively provided with a first avoidance hole and a second avoidance hole allowing the vibration panel to be connected with the support. The sealing film is configured to seal an assembly clearance of the first avoidance hole. At least one of the vibration panel and the support is provided with a support end surface corresponding to a surrounding region of the second avoidance hole. The sealing film is fixed on the support end surface.

公开(公告)号：US20250126403A1

公开(公告)日：2025-04-17

申请号：US19000648

申请日：2024-12-23

Applicant: SHENZHEN SHOKZ CO., LTD.

Inventor： Junjiang FU ,  Peigeng TONG ,  Le XIAO ,  Qianwen NIE

IPC: H04R1/28 ,  H04R1/08 ,  H04R1/10

Abstract: A core module and an electronic device are provided. The core module comprises a housing component, a transducer device, and a microphone component. The transducer device and the microphone component are disposed in the housing component. The microphone component includes a first microphone. The first microphone falls on the transducer device when being projected onto the transducer device along a vibration direction of the transducer device. The core module further comprises a limiting member disposed in the housing component. The limiting member is configured to stop the transducer device when a motion amplitude of the transducer device along the vibration direction exceeds a preset amplitude threshold, so as to maintain a preset distance between the transducer device and the first microphone to prevent the first microphone from being damaged by the transducer device, especially under an extreme operation condition such as the core module falling or colliding.

公开(公告)号：US20250119693A1

公开(公告)日：2025-04-10

申请号：US18986758

申请日：2024-12-19

Applicant: SHENZHEN SHOKZ CO., LTD.

Inventor： Liwei WANG ,  Lei ZHANG ,  Fengyun LIAO ,  Xin QI ,  Junjiang FU ,  Shuailin XIE ,  Chaowu LI

IPC: H04R9/02 ,  H04R7/12 ,  H04R7/18 ,  H04R9/04 ,  H04R9/06 ,  H04R25/00

Abstract: The present disclosure provides an acoustic device. The acoustic device may include a shell including a first accommodation cavity, a speaker configured in the first accommodation cavity. The speaker may include one or more magnetic circuit assemblies, a voice coil, a vibration assembly, and a vibration transmission plate. The one or more magnetic circuit assemblies may form a magnetic gap. One end of the voice coil may be arranged in a magnetic gap, and another end of the voice coil may be connected with the vibration assembly. The vibration assembly may be connected with the vibration transmission plate, and the vibration transmission plate may be connected with the shell.

公开(公告)号：US20250119689A1

公开(公告)日：2025-04-10

申请号：US18984905

申请日：2024-12-17

Applicant: Shenzhen Shokz Co., Ltd.

Inventor： Junjiang FU ,  Lei ZHANG ,  Fengyun LIAO ,  Xin QI

IPC: H04R1/10

Abstract: The present disclosure provides a sound output device, a sensory sound source adjustment method, and a volume adjustment method. The sound output device includes: a signal processing circuit to generate, during operation, a first electrical signal and a second electrical signal based on target sound information; a first speaker, electrically connected to the signal processing circuit to receive, during operation, the first electrical signal from the signal processing circuit and convert the first electrical signal into a first excitation to excite a first mechanical structure to generate a first sound wave; and a second speaker, electrically connected to the signal processing circuit to receive, during operation, the second electrical signal from the signal processing circuit and convert the second electrical signal into a second excitation to excite a second mechanical structure to generate a second sound wave.

公开(公告)号：US20250030969A1

公开(公告)日：2025-01-23

申请号：US18890758

申请日：2024-09-20

Applicant: SHENZHEN SHOKZ CO., LTD.

Inventor： Lei ZHANG ,  Junjiang FU ,  Bingyan YAN ,  Fengyun LIAO ,  Xin QI

IPC: H04R1/10 ,  G02C11/00 ,  G02C11/06 ,  G06F3/16 ,  G10L21/0208 ,  G10L21/0216 ,  G10L21/038 ,  H04M1/03 ,  H04M1/78 ,  H04R1/02 ,  H04R1/22 ,  H04R1/24 ,  H04R1/26 ,  H04R1/28 ,  H04R1/34 ,  H04R1/38 ,  H04R1/44 ,  H04R3/00 ,  H04R3/02 ,  H04R5/02 ,  H04R5/033 ,  H04R9/06 ,  H04S7/00 ,  H04W4/80

Abstract: The present disclosure provides an acoustic output apparatus. The acoustic output apparatus may include an acoustic output component and a supporting structure forming an acoustically open structure that allows the acoustic output component to acoustically communicate with the surroundings. The acoustic output component may include a plurality of acoustic drivers, each of which may be configured to output a sound with a frequency range. At least one of the acoustic drivers may include a magnetic system for generating a first magnetic field. The magnetic system may include a first magnetic component for generating a second magnetic field and at least one second magnetic component. A magnetic gap may be formed between the first magnetic component and the at least one second magnetic component. A magnetic field intensity of the first magnetic field in the magnetic gap may be greater than that of the second magnetic field in the magnetic gap.

公开(公告)号：US20240365069A1

公开(公告)日：2024-10-31

申请号：US18767961

申请日：2024-07-09

Applicant: SHENZHEN SHOKZ CO., LTD.

Inventor： Guangyuan ZHU ,  Lei ZHANG ,  Junjiang FU ,  Xin QI

IPC: H04R9/02 ,  H04R1/02 ,  H04R7/04 ,  H04R7/16 ,  H04R9/04 ,  H04R9/06

CPC classification number: H04R9/025 ,  H04R1/025 ,  H04R7/04 ,  H04R7/16 ,  H04R9/046 ,  H04R9/06

Abstract: The present disclosure application relates to a transducer, a loudspeaker, and an acoustic output device. The transducer comprises: a magnetic circuit system including a magnet, a magnetic conductive plate and a magnetic conductive cover, the magnet and the magnetic conductive plate being arranged along a vibration direction of the transducer; and a vibration plate including a first vibration plate and a second vibration plate, the first vibration plate and the second vibration plate being fixed on both sides of the magnet along a vibration direction of a magnet assembly and used to elastically support the magnet respectively; wherein the magnet is provided with a first hole, and the magnetic conductive plate is provided with a second hole, the second hole being arranged correspondingly to the first hole.

公开(公告)号：US20240365050A1

公开(公告)日：2024-10-31

申请号：US18766603

申请日：2024-07-08

Applicant: SHENZHEN SHOKZ CO., LTD.

Inventor： Lei ZHANG ,  Guangyuan ZHU ,  Junjiang FU ,  Xin QI

IPC: H04R1/28 ,  H04R9/02 ,  H04R9/04 ,  H04R9/06

CPC classification number: H04R1/2811 ,  H04R9/025 ,  H04R9/045 ,  H04R9/046 ,  H04R9/06 ,  H04R2400/07 ,  H04R2460/13

Abstract: The present disclosure application relates to a transducer, a loudspeaker, and an acoustic output device. The transducer comprises: a magnetic circuit system including a magnet, a magnetic conductive plate and a magnetic conductive cover, the magnet and the magnetic conductive plate being arranged along a vibration direction of the transducer; and a vibration plate including a first vibration plate and a second vibration plate, the first vibration plate or the second vibration plate being fixed on both sides of the magnet along the vibration direction of the transducer, and being configured to elastically support the magnet; wherein a ratio of a thickness of the magnetic conductive plate to a thickness of the magnet is in a range of 0.05-0.35.

公开(公告)号：US20240284109A1

公开(公告)日：2024-08-22

申请号：US18648980

申请日：2024-04-29

Applicant: SHENZHEN SHOKZ CO., LTD.

Inventor： Junjiang FU

IPC: H04R9/02 ,  H04R1/28 ,  H04R9/04

CPC classification number: H04R9/025 ,  H04R1/288 ,  H04R9/045

Abstract: The present disclosure relates to an earphone and a transducer device thereof. The transducer device may include a first magnet conductor, a coil, and a magnet assembly. An orthographic projection of the coil on a reference plane perpendicular to a first reference direction may surround an orthographic projection of at least a portion of the first magnet conductor on the reference plane. An orthographic projection of the magnet assembly on the reference plane may surround a periphery of the orthographic projection of the coil on the reference plane. One of the first magnet conductor and the magnet assembly may be connected to the coil. A magnetic field generated by the coil after an excitation signal is input may interact with a magnetic field generated by the magnet assembly to cause the first magnet conductor to move relative to the magnet assembly.

公开(公告)号：US20240179459A1

公开(公告)日：2024-05-30

申请号：US18433172

申请日：2024-02-05

Applicant: Shenzhen Shokz Co., Ltd.

Inventor： Lei ZHANG ,  Junjiang FU ,  Fengyun LIAO ,  Xin QI

IPC: H04R3/00 ,  H04R1/02 ,  H04R1/28 ,  H04R3/12 ,  H04R9/02 ,  H04R25/00

CPC classification number: H04R3/00 ,  H04R1/02 ,  H04R1/2803 ,  H04R3/12 ,  H04R9/025 ,  H04R25/50 ,  H04R2460/13

Abstract: The present application discloses a sound-output device, including a vibration speaker configured to generate a bone-conducted sound wave; and an air-conducted speaker configured to generate an air-conducted sound wave. The sound-output device further comprises a signal processing module configured to generate a control signal, wherein, the vibration speaker includes a vibration assembly electrically connected to the signal processing module to receive the control signal, and generate the bone-conducted sound wave based on the control signal, and the air-conducted speaker includes a housing coupled to the vibration assembly to generate the air-conducted sound wave based on the bone-conducted sound wave.

公开(公告)号：US20240147134A1

公开(公告)日：2024-05-02

申请号：US18544410

申请日：2023-12-18

Applicant: SHENZHEN SHOKZ CO., LTD.

Inventor： Junjiang FU ,  Yueqiang WANG ,  Chaojie CUI ,  Lei ZHONG ,  Zhi CAI ,  Yingying ZHANG ,  Weihua ZHOU ,  Piyou CHENG

IPC: H04R1/10

CPC classification number: H04R1/105 ,  H04R1/1008 ,  H04R1/1075 ,  H04R2460/13

Abstract: The present disclosure mainly relates to a headphone. The headphone may include a supporting assembly and a core module connected with the supporting assembly. The supporting assembly may be configured to support the core module to be worn at a wearing position. The core module may include a core housing, a transducer device, and a vibration panel. The transducer device may be provided in a accommodating cavity of the core housing, and the vibration panel may be connected with the transducer device and configured to transmit a mechanical vibration generated by the transducer device to a user.