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公开(公告)号：US11183620B2
公开(公告)日：2021-11-23
申请号：US16424178
申请日：2019-05-28
Applicant: SEOUL VIOSYS CO., LTD. , SEOUL VIOSYS CO., LTD.
Inventor： Se Hee Oh , Hyun A Kim , Jong Kyu Kim , Jong Hyeon Chae
IPC: H01L33/62 , H01L33/32 , H01L33/10 , H01L33/64 , H01L33/44 , H01L33/08 , H01L33/38 , H01L33/40 , H01L33/60 , F21S41/141 , F21Y115/10
Abstract: A light emitting diode having a plurality of light emitting cells is provided. The light emitting diode according to an exemplary embodiment includes a lower insulation layer covering an ohmic reflection layer, connectors disposed on the lower insulation layer to connect the light emitting cells, and an upper insulation layer covering the connectors and the lower insulation layer. An edge of the lower insulation layer is spaced apart farther from an edge of the upper insulation layer than an edge of the light emitting cell. The lower insulation layer susceptible to moisture may be protected and reliability of the light emitting diode may improve.
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公开(公告)号：US20230411436A1
公开(公告)日：2023-12-21
申请号：US18229143
申请日：2023-08-01
Applicant: Seoul Viosys Co., Ltd.
Inventor： Se Hee OH , Jong Kyu Kim , Joon Sub Lee
CPC classification number: H01L27/15 , H01L33/0016 , H01L33/405 , H01L33/62
Abstract: A chip-scale package type light emitting diode is provided. In the light emitting diode according to one embodiment, an opening exposing a pad metal layer is separated from an opening of a lower insulation layer which exposes an ohmic reflection layer formed on a mesa. Therefore, it is possible to prevent solder, particularly Sn, from diffusing and contaminating the ohmic reflection layer.
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3.发明授权公开(公告)号：US10128306B2
公开(公告)日：2018-11-13
申请号：US15401599
申请日：2017-01-09
Applicant: Seoul Viosys Co., Ltd.
Inventor： Sum Geun Lee , Sang Ki Jin , Jin Cheol Shin , Jong Kyu Kim , So Ra Lee , Chung Hoon Lee
IPC: H01L33/00 , H01L27/15 , H01L33/46 , H01L33/22 , H01L33/50 , H01L33/60 , H01L33/62 , H01L33/06 , H01L33/32 , H01L33/42
Abstract: A light-emitting diode package including a body and leads. The body comprising a mounting surface. The light emitting diode package also includes a light emitting diode chip including a substrate and a plurality of light emitting cells disposed on the substrate and positioned to be spaced apart from each other, each of the plurality of light emitting cells comprising an active layer disposed between a first conductive-type semiconductor layer and a second conductive-type semiconductor layer. The light emitting diode package also includes a phosphor member disposed on the light-emitting diode chip and a distributed Bragg reflector disposed on the substrate and between the plurality of light emitting cells.
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公开(公告)号：US09871168B2
公开(公告)日：2018-01-16
申请号：US14954835
申请日：2015-11-30
Applicant: Seoul Viosys Co., Ltd.
Inventor： Se Hee Oh , Yeo Jin Yoon , Jong Kyu Kim
CPC classification number: H01L33/20 , H01L27/153 , H01L33/0095 , H01L33/62
Abstract: Disclosed is a light emitting diode including a plurality of light emitting diode elements and a method of fabricating the same. The light emitting diode includes: a substrate; a plurality of light emitting diode elements disposed on the substrate; interconnection lines connecting the light emitting diode elements to each other, wherein the plurality of light emitting diode elements comprise outer light emitting diode elements aligned along an edge of the substrate, each of the outer light emitting diode elements comprises an inner face directed towards an adjacent light emitting diode element and an outer face disposed adjacent the edge of the substrate and directed towards an outside of the substrate, and the inner face of at least one of the outer light emitting diode elements comprises a more gently slanted side surface than the outer face thereof.
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公开(公告)号：US20170365638A9
公开(公告)日：2017-12-21
申请号：US15409306
申请日：2017-01-18
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Jong Kyu Kim , So Ra Lee , Yeo Jin Yoon , Jae Kwon Kim , Joon Sup Lee , Min Woo Kang , Se Hee Oh , Hyun A Kim , Hyoung Jin Lim
CPC classification number: H01L27/156 , H01L33/08 , H01L33/36 , H01L33/38 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/64 , H01L2224/16225 , H01L2224/32245 , H01L2924/181 , H01L2924/19107 , H01L2933/0016 , H01L2924/00012
Abstract: A light-emitting element includes a light-emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed between the first conductive semiconductor layer and the second conductive semiconductor layer; a first contact electrode and a second contact electrode located on the light-emitting structure, and respectively making ohmic contact with the first conductive semiconductor layer and the second conductive semiconductor layer; an insulation layer for covering a part of the first contact electrode and the second contact electrode so as to insulate the first contact electrode and the second contact electrode; a first electrode pad and a second electrode pad electrically connected to each of the first contact electrode and the second contact electrode; and a radiation pad formed on the insulation layer, and radiating heat generated from the light-emitting structure.
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Patent Agency Ranking
公开(公告)号：US09680060B2
公开(公告)日：2017-06-13
申请号：US15003928
申请日：2016-01-22
Applicant: Seoul Viosys Co., Ltd.
Inventor： Jae Kwon Kim , Yeo Jin Yoon , Jong Kyu Kim , So Ra Lee , Sum Geun Lee , Hyun Haeng Lee
IPC: H01L33/00 , H01L33/22 , H01L27/15 , H01L33/08 , H01L33/62 , H01L33/06 , H01L33/32 , H01L33/42 , H01L33/20
CPC classification number: H01L27/153 , H01L27/156 , H01L33/06 , H01L33/08 , H01L33/20 , H01L33/22 , H01L33/32 , H01L33/38 , H01L33/42 , H01L33/62
Abstract: A light emitting diode includes a substrate including a concave-convex pattern having concave portions and convex portions, a first light emitting unit disposed on the substrate, a second light emitting unit disposed on the substrate, a first wire connecting the first light emitting unit to the second light emitting unit over the concave-convex pattern, and an insulation layer disposed between the concave-convex pattern and the wire. The insulation layer has a shape corresponding to the concave-convex pattern.
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公开(公告)号：US09634061B2
公开(公告)日：2017-04-25
申请号：US15150863
申请日：2016-05-10
Applicant: Seoul Viosys Co., Ltd.
Inventor： Seom Geun Lee , Jong Kyu Kim , Yeo Jin Yoon , Jae Kwon Kim , Mae Yi Kim
IPC: H01L33/00 , H01L27/15 , H01L33/62 , H01L33/42 , H01L33/08 , H01L33/46 , H01L33/06 , H01L33/10 , H01L33/32 , H01L33/38 , H01L33/14 , H01L33/44
CPC classification number: H01L27/15 , H01L27/156 , H01L33/007 , H01L33/0075 , H01L33/06 , H01L33/08 , H01L33/10 , H01L33/14 , H01L33/145 , H01L33/32 , H01L33/38 , H01L33/42 , H01L33/44 , H01L33/46 , H01L33/62 , H01L2924/0002 , H01L2933/0016 , H01L2933/0066 , H01L2924/00
Abstract: A light emitting diode including a first light emitting cell and a second light emitting cell disposed on a substrate and spaced apart from each other to expose a surface of the substrate, a first transparent layer disposed on and electrically connected to the first light emitting cell, first connection section disposed on a portion of the first light emitting cell, a second connection section disposed on a portion of the second light emitting cell, a first interconnection and a second interconnection electrically connecting the first light emitting cell and the second light emitting cell, and an insulation layer disposed between the first and second interconnections and a side surface of the first light emitting cell.
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8.发明授权Light emitting diode chip having distributed Bragg reflector and method of fabricating the same 有权具有分布式布拉格反射体的发光二极管芯片及其制造方法公开(公告)号：US09577157B2
公开(公告)日：2017-02-21
申请号：US15069260
申请日：2016-03-14
Applicant: Seoul Viosys Co., Ltd.
Inventor： Sum Geun Lee , Sang Ki Jin , Jin Cheol Shin , Jong Kyu Kim , So Ra Lee , Chung Hoon Lee
CPC classification number: H01L27/153 , H01L33/0008 , H01L33/0079 , H01L33/06 , H01L33/22 , H01L33/32 , H01L33/42 , H01L33/46 , H01L33/505 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2933/0025 , H01L2933/0033 , H01L2933/0041 , H01L2933/0058 , H01L2924/00014
Abstract: A light-emitting diode package, including a package body and leads, the package body including a mounting surface, a light-emitting structure disposed on the mounting surface, the light-emitting structure including an active layer disposed between a first conductive-type semiconductor layer and a second conductive-type semiconductor layer, a phosphor layer disposed on the light-emitting structure, and a distributed Bragg reflector disposed between the light-emitting structure and the mounting surface. The distributed Bragg reflector includes a first distributed Bragg reflector and a second distributed Bragg reflector, and an optical thickness of material layers within the first distributed Bragg reflector is greater than an optical thickness of material layers within the second distributed Bragg reflector.
Abstract translation: 一种包括封装体和引线的发光二极管封装，所述封装体包括安装表面，设置在所述安装表面上的发光结构，所述发光结构包括设置在第一导电型半导体 层和第二导电型半导体层，设置在发光结构上的荧光体层和布置在发光结构和安装表面之间的分布式布拉格反射器。 分布式布拉格反射器包括第一分布式布拉格反射器和第二分布布拉格反射器，并且第一分布式布拉格反射器内的材料层的光学厚度大于第二分布布拉格反射器内材料层的光学厚度。
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公开(公告)号：USD776629S1
公开(公告)日：2017-01-17
申请号：US29535497
申请日：2015-08-06
Applicant: Seoul Viosys Co., Ltd.
Designer： Jong Kyu Kim , Yeo Jin Yoon
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公开(公告)号：US09269745B2
公开(公告)日：2016-02-23
申请号：US14087140
申请日：2013-11-22
Applicant: Seoul Viosys Co., Ltd.
Inventor： Jae Kwon Kim , Yeo Jin Yoon , Jong Kyu Kim , So Ra Lee , Sum Geun Lee , Hyun Haeng Lee
CPC classification number: H01L27/153 , H01L27/156 , H01L33/06 , H01L33/08 , H01L33/20 , H01L33/22 , H01L33/32 , H01L33/38 , H01L33/42 , H01L33/62
Abstract: Exemplary embodiments of the present invention provide a light emitting diode including light emitting units disposed on a substrate, and wires connecting the light emitting units to each other, wherein the light emitting units each include a parallelogram-shaped light emitting unit having two acute angles and two obtuse angles, or a triangular light emitting unit having three acute angles.
Abstract translation: 本发明的示例性实施例提供一种发光二极管，其包括设置在基板上的发光单元和将发光单元彼此连接的导线，其中发光单元各自包括具有两个锐角的平行四边形形状的发光单元， 两个钝角，或具有三个锐角的三角形发光单元。
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