LIGHT EMITTING DIODE CHIP HAVING DISTRIBUTED BRAGG REFLECTOR AND METHOD OF FABRICATING THE SAME
    1.
    发明申请
    LIGHT EMITTING DIODE CHIP HAVING DISTRIBUTED BRAGG REFLECTOR AND METHOD OF FABRICATING THE SAME 审中-公开
    具有分布式布拉格反射器的发光二极管芯片及其制造方法

    公开(公告)号:US20140087502A1

    公开(公告)日:2014-03-27

    申请号:US14091985

    申请日:2013-11-27

    IPC分类号: H01L33/46

    摘要: Exemplary embodiments of the present invention disclose a light emitting diode chip including a substrate having a first surface and a second surface, a light emitting structure arranged on the first surface of the substrate and including an active layer arranged between a first conductive-type semiconductor layer and a second conductive-type semiconductor layer, a distributed Bragg reflector arranged on the second surface of the substrate, the distributed Bragg reflector to reflect light emitted from the light emitting structure, and a metal layer arranged on the distributed Bragg reflector, wherein the distributed Bragg reflector has a reflectivity of at least 90% for light of a first wavelength in a blue wavelength range, light of a second wavelength in a green wavelength range, and light of a third wavelength in a red wavelength range.

    摘要翻译: 本发明的示例性实施例公开了一种包括具有第一表面和第二表面的基板的发光二极管芯片,布置在基板的第一表面上的发光结构,并且包括布置在第一导电类型半导体层 以及第二导电型半导体层,布置在基板的第二表面上的分布式布拉格反射器,用于反射从发光结构发射的光的分布式布拉格反射器和布置在分布式布拉格反射器上的金属层,其中分布式布拉格反射器 布拉格反射体对于蓝色波长范围内的第一波长的光,绿色波长范围的第二波长的光和红色波长范围的第三波长的光具有至少90%的反射率。