公开(公告)号：US20240042539A1

公开(公告)日：2024-02-08

申请号：US18380939

申请日：2023-10-17

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Tsutomu HIYAMA ,  Nobuhiro KOJIMA

IPC: B23K3/08 ,  B23K3/04 ,  G01M3/30

CPC classification number: B23K3/08 ,  B23K3/04 ,  G01M3/30 ,  B23K2101/42

Abstract: Provided is a soldering apparatus including: a furnace body including a processing chamber in which boards are processed; a gasket provided at least to a part of the furnace body, and configured to seal the furnace body; a sealed space isolated from the processing chamber, and defined by the furnace body and the gasket; a gas supply apparatus configured to supply a first gas into the sealed space; and a measuring apparatus configured to measure one of pressure in the sealed space and concentration of a second gas in the sealed space.

公开(公告)号：US20210402498A1

公开(公告)日：2021-12-30

申请号：US17328197

申请日：2021-05-24

Applicant: SENJU METAL INDUSTRY CO., LTD.

Inventor： Tsutomu HIYAMA ,  Nobuhiro KOJIMA

IPC: B23K3/08 ,  B23K3/04 ,  G01M3/30

Abstract: Provided is a soldering apparatus including: a furnace body including a processing chamber in which boards are processed; a gasket provided at least to a part of the furnace body, and configured to seal the furnace body; a sealed space isolated from the processing chamber, and defined by the furnace body and the gasket; a gas supply apparatus configured to supply a first gas into the sealed space; and a measuring apparatus configured to measure one of pressure in the sealed space and concentration of a second gas in the sealed space.