公开(公告)号：US20160336293A1

公开(公告)日：2016-11-17

申请号：US15220889

申请日：2016-07-27

申请人： SEMIgear, Inc.

发明人： Jian ZHANG ,  Joshua Pinnolis ,  Shijian Luo

IPC分类号： H01L23/00 ,  H01L21/66

CPC分类号： H01L24/81 ,  H01L22/12 ,  H01L24/743 ,  H01L24/75 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/8385 ,  H01L2224/83948 ,  H01L2224/92125 ,  H01L2224/92143 ,  H01L2924/06 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/00

摘要： Provided are a device packing facility and method using DEHT and a device processing apparatus utilizing the DEHT. The device packaging facility includes a mounting unit providing bis(2-ethylhexyl) terephthalate (DEHT) between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the DEHT and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.

摘要翻译： 提供了使用DEHT的设备包装设备和方法以及利用DEHT的设备处理设备。 所述装置包装设备包括在第一和第二装置之间提供双（2-乙基己基）对苯二甲酸酯（DEHT）的安装单元，以将第一和第二装置彼此附接;处理单元，热处理附接到每个装置的第一和第二装置 另一方面去除DEHT并将第一和第二设备彼此固定，以及传送单元，将从安装单元彼此附接的第一和第二设备传送到处理单元。

公开(公告)号：US09741683B2

公开(公告)日：2017-08-22

申请号：US15222468

申请日：2016-07-28

申请人： SEMIgear, Inc.

发明人： Jian Zhang ,  Joshua Pinnolis ,  Shijian Luo

IPC分类号： G01R31/26 ,  H01L23/00 ,  H01L21/66 ,  B23K1/00 ,  B23K1/20

CPC分类号： H01L24/81 ,  B23K1/0016 ,  B23K1/203 ,  H01L22/12 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/8385 ,  H01L2224/83948 ,  H01L2224/92143 ,  H01L2924/06 ,  H01L2924/20105 ,  H01L2924/20106

摘要： Provided are a device packing facility and method using phthalate and a device processing apparatus utilizing the phthalate. The device packaging facility includes a mounting unit providing phthalate between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the phthalate and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.

公开(公告)号：US10937757B2

公开(公告)日：2021-03-02

申请号：US16372420

申请日：2019-04-02

申请人： SEMIgear, Inc.

发明人： Jian Zhang ,  Joshua Pinnolis ,  Shijian Luo

IPC分类号： H01L23/00 ,  H01L21/66 ,  B23K1/20

摘要： Provided are a device packing facility and method using DEHT and a device processing apparatus utilizing the DEHT. The device packaging facility includes a mounting unit providing bis(2-ethylhexyl) terephthalate (DEHT) between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the DEHT and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.

公开(公告)号：US09824998B2

公开(公告)日：2017-11-21

申请号：US15220889

申请日：2016-07-27

申请人： SEMIgear, Inc.

发明人： Jian Zhang ,  Joshua Pinnolis ,  Shijian Luo

IPC分类号： G01R31/26 ,  H01L23/00 ,  H01L21/66

CPC分类号： H01L24/81 ,  H01L22/12 ,  H01L24/743 ,  H01L24/75 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/8385 ,  H01L2224/83948 ,  H01L2224/92125 ,  H01L2224/92143 ,  H01L2924/06 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/00

摘要： Provided are a device packing facility and method using DEHT and a device processing apparatus utilizing the DEHT. The device packaging facility includes a mounting unit providing bis(2-ethylhexyl) terephthalate (DEHT) between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the DEHT and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.

公开(公告)号：US09472531B2

公开(公告)日：2016-10-18

申请号：US14616029

申请日：2015-02-06

申请人： SEMIgear, Inc.

发明人： Jian Zhang ,  Joshua Pinnolis ,  Shijian Luo

IPC分类号： G01R31/26 ,  H01L23/00 ,  H01L21/66

CPC分类号： H01L24/81 ,  B23K1/0016 ,  B23K1/203 ,  H01L22/12 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/8385 ,  H01L2224/83948 ,  H01L2224/92143 ,  H01L2924/06 ,  H01L2924/20105 ,  H01L2924/20106

摘要： Provided are a device packing facility and method using phthalate and a device processing apparatus utilizing the phthalate. The device packaging facility includes a mounting unit providing phthalate between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the phthalate and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.

摘要翻译： 提供使用邻苯二甲酸酯的装置包装设备和方法以及利用邻苯二甲酸酯的装置处理装置。 所述装置包装设备包括：安装单元，其在第一和第二装置之间提供邻苯二甲酸酯，以将第一和第二装置彼此附接;加工单元，热处理彼此附接的第一和第二装置，以除去邻苯二甲酸酯并固定第一 和第二装置，以及传送单元，将从安装单元彼此附接的第一和第二装置传送到处理单元。