公开(公告)号：US12090642B2

公开(公告)日：2024-09-17

申请号：US17002008

申请日：2020-08-25

申请人： SEMES CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

发明人： Chang Bu Jeong ,  Jong Sung Park ,  Jung Sub Kim ,  Young Gun Park ,  Dae Seok Choi ,  Sang Hoon Jung ,  Min Gu Lee ,  Eui Sun Choi ,  Kang San Lee ,  Dae Ho Min ,  Seung Dae Seok

IPC分类号： B25J15/06 ,  B65G47/91

CPC分类号： B25J15/0616 ,  B65G47/911 ,  B65G2249/045

摘要： Provided are a die pickup module and a die bonding apparatus including the same. The die pickup module includes a wafer stage for supporting a wafer including dies attached on a dicing tape, a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape, a non-contact picker for picking up the die in a non-contact manner so as not to contact a front surface of the die, a vertical driving unit for moving the non-contact picker in a vertical direction to pick up the die and an inverting driving unit for inverting the non-contact picker to invert a die picked up by the non-contact picker.

公开(公告)号：US20210060798A1

公开(公告)日：2021-03-04

申请号：US17002008

申请日：2020-08-25

申请人： SEMES CO., LTD.

发明人： Chang Bu Jeong ,  Jong Sung Park ,  Jung Sub Kim ,  Young Gun Park ,  Dae Seok Choi ,  Sang Hoon Jung

IPC分类号： B25J15/06 ,  B65G47/91

摘要： Provided are a die pickup module and a die bonding apparatus including the same. The die pickup module includes a wafer stage for supporting a wafer including dies attached on a dicing tape, a die ejector arranged under the dicing tape and for separating a die to be picked up from the dicing tape, a non-contact picker for picking up the die in a non-contact manner so as not to contact a front surface of the die, a vertical driving unit for moving the non-contact picker in a vertical direction to pick up the die and an inverting driving unit for inverting the non-contact picker to invert a die picked up by the non-contact picker.