公开(公告)号：US20220205100A1

公开(公告)日：2022-06-30

申请号：US17566874

申请日：2021-12-31

Applicant: SEMES CO., LTD.

Inventor： Byoung Doo CHOI ,  Jin Ho CHOI

IPC: C23C16/455 ,  H01L21/02 ,  H01L21/47

Abstract: A substrate treating apparatus is disclosed. The substrate treating apparatus includes a treating container having a treatment space to treat a substrate, a standby port positioned at one side of the treating container to allow a nozzle, which discharges a treatment liquid, to stand by, and a liquid supplying unit moving between the treating container and the standby port and having the nozzle. The standby port includes a nozzle receiving member including a nozzle receiving unit having a receiving space formed inside the nozzle receiving unit to receive the nozzle and a cleaning liquid and a discharge part having a discharge port provided at one side of the nozzle cleaning unit to discharge the cleaning liquid to the nozzle. The discharge port is provided to overlap at least a portion of the nozzle when viewed from above.

公开(公告)号：US20240186155A1

公开(公告)日：2024-06-06

申请号：US18523893

申请日：2023-11-30

Applicant: SEMES CO., LTD.

Inventor： Ki Sang EUM ,  Dong Woon PARK ,  Young Jun SON ,  Woo Ram LEE ,  Jin Ho CHOI

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67051 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67253 ,  H01L21/68785

Abstract: Proposed is a substrate processing apparatus for cleaning the bottom surface of a substrate. The apparatus includes a processing container configured to form a processing space for a substrate, a substrate support unit provided inside the processing space and configured to support the substrate, a first nozzle unit configured to have a first nozzle member provided on a side of the substrate support unit inside the processing space and supplying a processing fluid toward a center area of a bottom surface of the substrate, and a second nozzle member provided to be fixedly coupled to the substrate support unit and supplying a processing fluid toward an edge area of the bottom surface of the substrate, wherein the first nozzle member is provided to rotate between a center position and an end position of the bottom surface of the substrate.

公开(公告)号：US20220163891A1

公开(公告)日：2022-05-26

申请号：US17522007

申请日：2021-11-09

Applicant: SEMES CO., LTD.

Inventor： Ki Sang EUM ,  Jin Ho CHOI ,  Sun Wook JUNG ,  Byoung Doo CHOI ,  Hee Man AHN ,  Si Eun KIM

IPC: G03F7/16

Abstract: An apparatus for treating a substrate includes a treating vessel having an inner space, a support unit that supports and rotates the substrate in the inner space, and an exhaust unit that releases an air flow in the inner space. The exhaust unit includes an air-flow guide duct into which the air flow is introduced in a tangential direction with respect to a rotating direction of the substrate supported on the support unit.

公开(公告)号：US20220165589A1

公开(公告)日：2022-05-26

申请号：US17533348

申请日：2021-11-23

Applicant: SEMES CO., LTD.

Inventor： Ki Sang EUM ,  Jin Ho CHOI ,  Byoung Doo CHOI ,  Seung Han LEE ,  Sun Wook JUNG ,  Si Eun KIM

IPC: H01L21/67 ,  C23C16/455 ,  C23C16/44 ,  H01L21/687 ,  H01L21/02

Abstract: An apparatus for treating a substrate, the apparatus comprising: a processing container having an inner space; a support unit having a support plate configured to support and rotate the substrate in the inner space; a liquid supply unit supplying treating liquid to the substrate supported by the support unit; and an exhaust unit exhausting an air flow in the inner space, wherein the processing container includes a bottom wall and a side wall extending from the outside end of the bottom wall, the processing container including a first gas-liquid separator provided at the side wall.

公开(公告)号：US20150117987A1

公开(公告)日：2015-04-30

申请号：US14527936

申请日：2014-10-30

Applicant: Semes Co., Ltd.

Inventor： Jin Ho CHOI ,  Ju Mi YOO

IPC: H01L21/677 ,  B25J11/00 ,  F04B49/20

CPC classification number: F04B49/20 ,  F04B49/06 ,  F04B49/103 ,  F04B2201/0201 ,  F04B2201/0202 ,  H01L21/67259 ,  H01L21/67742

Abstract: Provided is a substrate treating apparatus. The substrate treating apparatus includes: a transfer chamber conveying a substrate; a process chamber disposed adjacent to the transfer chamber and performing a treating process o the substrate; and a drive assembly supplying a power by which a component of the transfer chamber or the process chamber operates, wherein the drive assembly includes: a cylinder connected to pipes; a piston disposed to be movable inside the cylinder and connected to the component by a drive shaft; and a pipe control unit automatically adjusting a moving speed of the piston.

Abstract translation: 提供了一种基板处理装置。 基板处理装置包括：传送基板的传送室; 处理室，邻近所述传送室设置并执行所述衬底的处理过程; 以及驱动组件，其提供所述传送室或所述处理室的部件通过其工作的功率，其中所述驱动组件包括：连接到管道的气缸; 活塞，其设置成可在所述气缸内移动并通过驱动轴与所述部件连接; 以及管道控制单元自动调节活塞的移动速度。