摘要:
Disclosed are non-spherical resin particles that allow for improvement of light diffusion, light reflection, and other related properties, and a manufacturing method thereof. The particles comprise first and second, different resin components (1) and (2), with the second resin component (2) residing locally near the surface of the non-spherical resin particles. The method of manufacturing non-spherical resin particles involves either allowing particles of a resin to absorb a vinyl-based polymerizable monomer contained in an aqueous emulsion followed by polymerization of the absorbed monomer or dissolving a resin in a vinyl-based polymerizable monomer followed by polymerization of the obtained solution in an aqueous medium. In the method, the resin has a site derived from a (meth)acrylic acid ester having a C2-C10 halogenated alkyl group or alicyclic hydrocarbon group and has a weight-average molecular weight of from 150,000 to 1,000,000. The vinyl-based polymerizable monomer contains 5 to 50 wt % crosslinking monomer.
摘要:
Porous resin particles are disclosed that comprise a polymer of a monomer mixture. The monomer mixture includes: a mono(meth)acrylate-based monomer in an amount of 3 wt % to 40 wt % containing: an ethylenic unsaturated group only in a (meth)acrylic acid residue; and a hydroxyl group and at least either an ether group or an ester group in an alcohol residue; another monofunctional vinyl-based monomer in an amount of 10 wt % to 69 wt % containing a single ethylenic unsaturated group; and a polyfunctional vinyl-based monomer in an amount of 30 wt % to 70 wt % containing two or more ethylenic unsaturated groups.
摘要:
Silica-including microcapsule resin particles including an outer shell constituted of a crosslinked polymer and a cavity partitioned with the outer shell, in which the silica-including microcapsule resin particles contain inside the cavity a porous structure in which silica particles are mutually connected, and have a volume average particle diameter of 0.5 to 100 μm.
摘要:
The present invention provides vinyl-based resin particles capable of easily smoothing the surface of a thermosetting resin film when the particles are used as a pore-forming material for a thermosetting resin. Specifically, the present invention provides vinyl-based resin particles for use in making a thermosetting resin porous, the particles having a temperature of 230° C. or higher and lower than 300° C. at 10% mass loss when heated at a rate of 10° C./min in an air atmosphere, and the particles having a mass loss percentage of 85 to 100% after being heated at 350° C. for 5 hours in an air atmosphere.
摘要:
Silica-including microcapsule resin particles including an outer shell constituted of a crosslinked polymer and a cavity partitioned with the outer shell, in which the silica-including microcapsule resin particles contain inside the cavity a porous structure in which silica particles are mutually connected, and have a volume average particle diameter of 0.5 to 100 μm.
摘要:
A high-recoverability resin particles having a mean particle size of 1 to 100 μm containing a cross-linked (meth)acrylic acid ester-based resin, wherein the high-recoverability resin particles have a recovery rate of 22% or greater, and a 30% compression strength of 1.5 to 5.0 kgf/mm2.
摘要:
Spacer particles for a resin composition layer have a compressive strength at 10% compressive deformation (10% compressive strength) at room temperature (rt) of 0.05 to 10 MPa, have a rate of change in 10% compressive strength-by a temperature change from rt to 50° C. of 5% or less or have a rate of change in 10% compressive strength by a temperature change from −20° C. to rt of 30% or less, and have a volume average particle diameter of 2 to 200 μm and a coefficient of variation in particle diameter of 15% or less.
摘要:
Spacer particles for a resin composition layer have a compressive strength at 10% compressive deformation (10% compressive strength) at room temperature (rt) of 0.05 to 10 MPa or a compressive strength at room temperature of 0.01 to 2 N determined as a compressive load at 10% compressive deformation in a film state, have a rate of change in 10% compressive strength by a temperature change from rt to 50° C. of 5% or less, a rate of change in 10% compressive strength by a temperature change from −20° C. to rt of 30% or less, or a rate of change in compressive strength by a temperature change from −50° C. to 50° C. of 15% or less determined as a compressive load at 10% compressive deformation in a film state, and have a volume average particle diameter of 2 to 200 μm and a coefficient of variation in particle diameter of 15% or less.