公开(公告)号：US20230155345A1

公开(公告)日：2023-05-18

申请号：US18099336

申请日：2023-01-20

申请人： Schott AG

发明人： Artit Aowudomsuk ,  Reinhard Ecker

IPC分类号： H01S5/02212 ,  H01S5/023 ,  H01S5/024

CPC分类号： H01S5/02212 ,  H01S5/023 ,  H01S5/02415

摘要： A socket for an electronic component includes: an electrically insulating material; a base body including at least one opening configured for accommodating an electrically conductive pin configured for being electrically connected to the electronic component, the at least one opening being sealed with the electrically insulating material such that the electrically conductive pin is fed through the at least one opening while being electrically insulated from the base body; and a shell part including a pedestal configured for accommodating the electronic component, at least the shell part of the socket including a metal with a thermal conductivity of at least 100 W/mK.

公开(公告)号：US11367692B2

公开(公告)日：2022-06-21

申请号：US15482357

申请日：2017-04-07

申请人： SCHOTT AG

发明人： Robert Hettler ,  Reinhard Ecker ,  Martin Lindner-Stettenfeld ,  Georg Mittermeier

IPC分类号： G02B7/02 ,  H01L23/00 ,  H01L23/04 ,  H01L23/06 ,  H01L23/08 ,  H01L31/0203 ,  H01L31/0232 ,  H01S5/02212

摘要： A lens cap for a transistor outline (TO) package is provided that has an inner diameter of less than 4 mm. The lens cap includes a metal shell with a wall thickness of less than 0.2 mm and a thinned area surrounding the lens so that in the thinned area the wall thickness is reduced by at least 35%.

公开(公告)号：US20170294390A1

公开(公告)日：2017-10-12

申请号：US15482357

申请日：2017-04-07

申请人： SCHOTT AG

发明人： Robert Hettler ,  Reinhard Ecker ,  Martin Lindner-Stettenfeld ,  Georg Mittermeier

IPC分类号： H01L23/00 ,  H01L23/08 ,  H01L23/06 ,  H01L23/04

CPC分类号： H01L23/564 ,  H01L23/041 ,  H01L23/06 ,  H01L23/08 ,  H01L31/0203 ,  H01L31/02325 ,  H01S5/02212 ,  H01S5/02288

摘要： A lens cap for a transistor outline (TO) package is provided that has an inner diameter of less than 4 mm. The lens cap includes a metal shell with a wall thickness of less than 0.2 mm and a thinned area surrounding the lens so that in the thinned area the wall thickness is reduced by at least 35%.

公开(公告)号：US20240047100A1

公开(公告)日：2024-02-08

申请号：US18491459

申请日：2023-10-20

申请人： Schott AG

发明人： Helmut Hartl ,  Reinhard Ecker ,  Christian Mix

IPC分类号： H01B7/40 ,  F01N13/18 ,  F02B39/00 ,  B01D53/94

CPC分类号： H01B7/40 ,  F01N13/1805 ,  F02B39/00 ,  B01D53/94 ,  B01D2258/01

摘要： A feedthrough in a housing component that is subject to thermal loading for a functional assembly includes: an inner conductor; an outer conductor having a sleeve assigned to or formed on the outer conductor that retains or makes it possible to fasten the feedthrough to the housing component; and an electrically insulating component between the outer conductor and the inner conductor, the electrically insulating component retaining the inner conductor relative to the outer conductor in an electrically insulated fashion.

公开(公告)号：US20210130758A1

公开(公告)日：2021-05-06

申请号：US16994744

申请日：2020-08-17

申请人： SCHOTT AG

发明人： Christian Ott ,  Robert Hettler ,  Christoph Stangl ,  Helena Blümel ,  Reinhard Ecker

IPC分类号： C12M1/12 ,  C12M1/00

摘要： A biocompatible composite element for a bioreactor is provided that includes an outer frame and an inner component. The outer frame is a polymeric material. The outer frame can be inseparably attached to a wall of the bioreactor. The inner component is a transparent material selected from a group consisting of glass, sapphire, and glass ceramic. The inner component is secured in the outer component in an inseparable hermetically tight manner. The inner component is configured for a spectral process control through the transparent material of the inner component.