公开(公告)号：US20240337933A1

公开(公告)日：2024-10-10

申请号：US18536373

申请日：2023-12-12

申请人： SAMSUNG SDI CO., LTD. ,  SAMSUNG ELECTRONICS CO., LTD.

发明人： Ran NAMGUNG ,  Kyoungjin HA ,  Hyeon PARK ,  Daeseok SONG ,  Minsoo KIM ,  Sanghyun JE ,  Jun Soo KIM ,  Soyeon YOO ,  Su Min PARK ,  Suk-Koo Hong

IPC分类号： G03F7/004 ,  C08F114/16 ,  C08F220/18 ,  C08F220/22 ,  C08K5/05 ,  C08K5/06 ,  H01L21/027

CPC分类号： G03F7/0048 ,  C08F114/16 ,  C08F220/1806 ,  C08F220/22 ,  C08K5/05 ,  C08K5/06 ,  H01L21/0274

摘要： A resist topcoat composition and a method of forming patterns utilizing the resist topcoat composition are provided. The resist topcoat composition includes a copolymer including a first structural unit represented by Chemical Formula M-1 and a second structural unit represented by Chemical Formula M-2; and a solvent.